Samsung Electronics Co., Ltd.

Hangyu Hwang

Sungho Cho

Changsu Kim

Sangsik Na

Yoonhee Lee

Seungchang Baek

Junghyun Im

Jongbae Jeon

Hyunjung Jung

Pranveer Singh Rathore

Jongchul Choi

Minwoo Yoo

Jungwoo Choi

Changyoun Hwang

Hyeongsam Son

Rathore Pranveer Singh

Jinho Kim

Jinwoo Park

Hyunsuk Choi

Yongseok Lee

Jongsik Kim

Youngjong Shin

Ingook Hong

Jinho Lim

HyeonWoo Lee

Sooyoung Kim

Youngjin Yi

Hongbum Park

Jeonga Kang

Donghyeon Hwang

Kwangyoun Lee

Heekwang Lim

Youngsoo Ha

Joungki Park

Changhyeok Shin

Jungho Hwang

Dukjin Kim

Junpil Kim

Jinshik Lim

Yeonghwan Gong

Youngoh Kim

Juncheol Shin

Jinhyeong Park

Youngik Son

Sunyoung Ji

Younghee Choi

Sangbeom Ko

Jongyoul Noh

Hyosang Lim

Seungsoo Han

A portable electronic device is provided. The portable electronic device includes a metal housing, an antenna module positioned in the metal housing, a first injection-molded member positioned in a radiation direction of the antenna module and having a first dielectric constant, a second injection-molded member at least partially in contact with the first injection-molded member, positioned in the radiation direction of the antenna module, and having a second dielectric constant different from the first dielectric constant, and a first organic film disposed along an inner surface of the metal housing to bond with at least a portion of the first injection-molded member, wherein the second injection-molded member forms, together with the metal housing, an exterior of the portable electronic device, and wherein the second injection-molded member is coupled with the first injection-molded member through a coupling structure in which one of the first injection-molded member or the second injection-molded member is at least partially protruding into another one of the first injection-molded member or the second injection-molded member.

Electronic device including antenna module

According to certain embodiments, an electronic device housing comprises: a substrate including: a front surface comprising a plurality of front surface protrusions and a plurality of taper protrusions protruding from the plurality of front surface protrusions and a rear surface comprising a plurality of rear surface protrusions; and wherein two protrusions selected from the plurality of front surface protrusions, the plurality of taper protrusions, and the plurality of rear surface protrusions are different from each remaining ones of the plurality of front surface protrusions, the plurality of taper protrusions, and the plurality of rear surface protrusions; a deposition layer formed on the front surface of the substrate; and a transparent coating layer formed on the rear surface of the substrate.

Electronic device housing with protrusions and electronic device including the same

A housing of an electronic device includes two or more metal portions, each having an oxide film layer formed on a surface thereof, and a non-conductive portion formed to cover at least a portion of the oxide film layer.

Housing of electronic device with different bonded metals and method of manufacturing the same

An electronic device according to an embodiment may include a housing comprising: an outer portion defining at least a portion of an exterior of the electronic device and comprising a first conductive material, an inner portion comprising a second conductive material having a first melting point different from that of the first conductive material and at least partially defining a space for receiving multiple electronic components arranged inside the electronic device, and a middle portion comprising a third conductive material having a second melting point and an injection molded insulator, wherein the third conductive material of the middle portion and the first conductive material of the outer portion are coupled to form a concave-convex structure, a difference between the first melting point and the second melting point is in a first range, and the third conductive material of the middle portion is electrically connected to the second conductive material of the inner portion.

Electronic device including metal member

An electronic device is provided. The electronic device includes a display, a frame structure including a first conductive member defining an external appearance of the electronic device and operated as an antenna element of the electronic device, a second conductive member coupled and electrically connected to the first conductive member, and a nonconductive member that supports the display together with the second conductive member, a bonding layer including a first layer at least partially disposed between the first conductive member and the nonconductive member, and a second layer at least partially disposed between the second conductive member and the nonconductive member, and at least one conductive connection member disposed at a portion, at which the first conductive member and the second conductive member are coupled to each other, and contacting the first conductive member and the second conductive member.

Electronic device including conductive connection member

An electronic device is provided. The electronic device includes a housing; and a coating layer formed on at least a portion of a surface of the housing, wherein the coating layer comprises a paint, the paint including a one-component acrylate-based paint having a property of being cured by an ultraviolet (UV) light, or a one-component or two-component paint containing acryl and urethane and having a property of being cured by heat, wherein the coating layer has a pattern structure including an uneven pattern through laser processing on a portion of a coating film formed by applying the paint, and wherein two or more regions having different glossiness may exist on the surface of the housing by the pattern structure of the coating layer.

Electronic device including housing and method for manufacturing the housing

According to an embodiment, an electronic device includes a housing providing an inner space, a sensor disposed in the inner space, and a key button including an electrode electrically connected to the sensor and configured to obtain biometric information through a contact with an external object through the sensor, wherein the key button includes a metal layer, a deposited layer including a hole connected to a part of the metal layer and disposed on the metal layer, and a conductive material disposed in the hole and contact with the metal layer exposed through the hole, wherein a diameter of one side of the hole facing an outside is greater than a thickness of the deposited layer.

Electronic device including conductive key button

Various embodiments of the present disclosure relate to an electronic device including a housing and a method of manufacturing the housing. The electronic device includes a housing forming an exterior of the electronic device. The housing is constituted to include a non-conductive part including a non-conductive protrusion protruded from at least some area of the non-conductive part, a conductive deposition layer disposed on a top surface of the non-conductive part except on the non-conductive protrusion, and a decoration layer formed on the top of the conductive deposition layer. Accordingly, the housing is lightweight and can perform a function of an antenna radiator. Other various embodiments are possible.

A method for manufacturing an electronic device, according to one embodiment of the present invention, may comprise the operations of: inserting and injecting a polymeric material into a structure, which is a plate-shaped metal structure comprising a first surface and a second surface, the structure comprising: at least one opening penetrating the first surface and the second surface; and at least one recess having a first depth from the first surface and extending to have a repeating pattern selected from among a W-shape, a sawtooth shape, and a straight line shape, when viewed from above the first surface; and confirming that the recess is filled with the polymeric material. Various other embodiments are possible.

Electronic device member of metallic structure and non-metallic structure, and method for manufacturing same

According to an embodiment of the disclosure, an electronic device may include a housing including a rear plate including a first region having a first concavo-convex pattern formed therein, and a second region having a second concavo-convex pattern formed therein, and a processor disposed inside the housing. The first concavo-convex pattern and the second concavo-convex pattern may be integrally formed with the rear plate, and a first depth of the first concavo-convex pattern may be different from a second depth of the second concavo-convex pattern.

Electronic device including housing

An electronic device and method for forming a housing of the same is disclosed. The electronic device includes: a housing including: a first plate forming a front surface of the housing, a second plate integrally forming a rear surface and side surface of the housing, wherein a space is enclosed between the front surface, side surface and rear surface, and wherein the second plate includes a first surface forming the side and rear surfaces of the housing, and a second surface disposed opposite to the first surface, and a display disposed in the space and at least partially visible through the first plate, wherein at least a portion of the second surface includes a pattern having surface roughness having a height of 0.1 μm to 1 μm.

Electronic device including housing and method of producing the housing

An electronic device includes a front plate, a back plate that faces away from the front plate, a display, a frame, a polymer member, and an adhesive layer. The display is disposed between the front plate and the back plate and visible through the front plate. The frame surrounds an interior space between the front plate and the back plate and formed of a metallic material. The frame includes a first metal part and a second metal part. The polymer member is coupled to the frame and contains a polymer material. The adhesive layer bonds the polymer member and the frame. The frame includes an opening formed in a first part thereof. The opening is formed through the first metal part and being formed to a specified depth through the second metal part. The polymer member forms at least part of an inner surface of the opening.

Electronic device including metal housing

An electronic device is disclosed. The electronic device includes: a window; a display disposed in a first direction of the window; a housing including a first surface and a second surface extended from the first surface toward the window; a first film layer disposed on an inner surface of the housing and including: a first area that overlaps at least a portion of the first surface and is substantially transparent or translucent; and a second area that is extended from an edge of the first area along the second surface, and is substantially opaque; and a second film layer disposed on the first film layer in a second direction opposite to the first direction, the second film layer overlapping an entirety of the first area of the first film layer and overlapping a portion of the second area. Other embodiments are possible.

An electronic device according to various embodiments of the present disclosure includes a housing including a front plate facing a first direction, a rear plate facing a second direction that is opposite to the first direction, and side members for encompassing the inner space between the front plate and the rear plate; a display shown through at least a portion of the front plate; and a middle plate positioned between the front plate and the rear plate. The middle plate can include a first portion disposed between the front plate and the side members, when viewed from the outside of the housing. The first portion can include: a first surface supporting a portion of the front plate and facing the first direction; a second surface exposed to the outside of the housing; a third surface facing a third direction that is different from the first direction and the second direction, and facing the side surface of the front plate; and a protruding part protruding in the third direction on the third surface.

Electronic device including injection structure, and injection mold structure for injection structure

A cover device according to an embodiment of the present invention, may include a first plate including a first surface and a second surface facing away from the first surface, and being substantially rectangular, the first plate including a first edge having a first length and extending in a first direction, a second edge having a second length longer than the first length and extending in a second direction orthogonal to the first direction, a third edge parallel to the first edge, having the first length, and extending in the first direction from the second edge, and a fourth edge parallel to the second edge, having the second length, and extending from the first edge in the second direction, a first sidewall perpendicular to the first surface and extending from the first edge, a second sidewall perpendicular to the first surface and the first sidewall and extending from the second edge, a third sidewall perpendicular to the first surface and the second sidewall and extending from the third edge, and a fourth sidewall perpendicular to the first surface and the third sidewall and extending from the fourth edge, wherein the first surface, the first sidewall, the second sidewall, the third sidewall and the fourth sidewall together may form a recess for receiving and holding the electronic device, and the first surface may include at least one parting line having a third length longer than the first length and shorter than the second length and extending in the second direction.

Cover device for holding electronic device

Growing community of inventors

Suwon-si, South Korea

Hangyu Hwang