Semes Co., Ltd.

Hanglim Lee

Minyoung Kim

Jihoon Park

Do Heon Kim

Kwangsup Kim

Doyeon Kim

Choonghyun Lee

Soo Ill Jang

Jungsuk Goh

Yungi Kim

Hyo Seok Lee

Provided is a substrate processing apparatus and substrate processing method capable of processing a substrate by using plasma, the substrate processing apparatus including a process chamber providing an internal space where a substrate is processed, a spin chuck serving as a lower electrode, supporting the substrate in the internal space of the process chamber, and rotating the supported substrate, and a plasma generation unit mounted in an upper portion of the process chamber to face the spin chuck, including a discharge space where an upper electrode is provided, generating plasma by using a process gas supplied from outside, linearly ejecting the plasma onto the substrate rotated by the spin chuck, and controlling a density of the plasma to change along an extension direction of the linearly ejected plasma.

Substrate processing apparatus and substrate processing method

Disclosed are a die bonding apparatus, a substrate bonding apparatus, a die bonding method, and a substrate bonding method that are capable of bonding a die to a substrate or bonding substrates together without using a bonding medium such as an adhesion film and a solder bump. The die bonding method includes hydrophilizing a bonding surface of the die, by plasma processing, forming a liquid film on a bonding area of the substrate, by supplying a liquid including water to the bonding area of the substrate, pre-bonding the die to the substrate by bringing the die into contact with the liquid film, and post-bonding one or more dies to the substrate at the same time, by performing heat treatment in a state in which the one or more dies are pre-bonded to the substrate.

Die bonding apparatus and method and substrate bonding apparatus and method

Growing community of inventors

Cheonan-si, South Korea

Hanglim Lee