Globalfoundries Singapore Pte. Ltd.

Fultec Semiconductor, Inc.

Handoko Linewih

Yudi Setiawan

Da-Wei Lai

Ying-Chang Lin

Siow Lee Chwa

Chengang Feng

Chor Shu Cheng

Yanxia Shao

Qiying Wong

Darin A Chan

Chien-Hsin Lee

Tze Ho Simon Chan

Pinghui Li

Xuesong Rao

Ming Li

Ruchil Kumar Jain

Richard A Harris

Wei Gao

Yi Lu

Shu Zhong

Chao Cheng

Phyllis Shi Ya Lim

Sevashanmugam Marimuthu

Ronghua Yu

The present disclosure relates to semiconductor structures and, more particularly, to heat dissipating structures and methods of manufacture. The structure includes: a thin film resistor within a back end of the line structure; and a heat dissipating structure below the thin film resistor, the heat dissipating structure includes a top plate with a slotted configuration and being within the back end of the line structure.

Heat dissipating structures

A one-time programmable (OTP) fuse includes a fuse link including a thin film resistor (TFR) layer between a first insulator layer and a second insulator layer. A first terminal of the OTP fuse includes a first conductive pillar through one of the first and second insulator layers and in contact with the TFR layer; and a second terminal of the OTP fuse includes a second conductive pillar through one of the first and second insulator layers and in contact with the TFR layer. The second conductive pillar and the TFR layer have a lateral contact interface having a same shape as an outer portion of the second conductive pillar. The second conductive pillar does not simply land on the TFR layer, but extends through it. Application of a current to the OTP fuse results in programming via rupture of the lateral contact interface (not electromigration in the fuse link).

One-time programmable fuse using thin film resistor layer, and related method

A device may include a substrate, and an interlevel dielectric arranged over the substrate. The interlevel dielectric may include a first interlevel dielectric layer in an interconnect level i, the first interlevel dielectric layer having a first interconnect and a second interconnect therein. A nitride block insulator may be arranged over the first interlevel dielectric layer and over the first interconnect and the second interconnect. An opening may be arranged in the nitride block insulator, the opening extending through the nitride block insulator to expose a surface of the first interconnect in the first interlevel dielectric layer. A contact plug may be arranged in the opening of the nitride block insulator. The contact plug at least lines the opening and prevents out-diffusion of conductive material from the first interconnect. A thin film of a passive component may be arranged over the nitride block insulator and over the contact plug.

Thin film based passive devices and methods of forming the same

A semiconductor device is provided. The semiconductor device comprises a substrate having a first surface and a second surface, the substrate comprising a wide bandgap semiconductor material. An epitaxial layer is on the first surface of the substrate and a metal germanosilicide layer is above the second surface of the substrate. The metal germanosilicide layer forms an ohmic contact to the substrate.

Metal semiconductor contacts

The present disclosure generally relates to a semiconductor device having a capacitor and a resistor and a method of forming the same. More particularly, the present disclosure relates to a metal-insulator-metal (MIM) capacitor and a thin film resistor (TFR) formed in a back end of line portion of an integrated circuit (IC) chip.

Semiconductor device having capacitor and resistor and a method of forming the same

The present disclosure generally to semiconductor devices, and more particularly to semiconductor devices having high-voltage transistors integrated on a semiconductor-on-insulator substrate and methods of forming the same. The present disclosure provides a semiconductor device including a semiconductor-on-insulator (SOI) substrate having a semiconductor layer, a bulk substrate and an insulating layer between the semiconductor layer and the bulk substrate, a source region and a drain region disposed on the bulk substrate, an isolation structure extending through the insulating layer and the semiconductor layer and terminates in the bulk substrate, and a gate structure between the source region and the drain region, the gate structure is disposed on the semiconductor layer.

High-voltage devices integrated on semiconductor-on-insulator substrate

The present disclosure relates to semiconductor structures and, more particularly, to an integrated thin film resistor with a metal-insulator-metal capacitor and methods of manufacture. The structure includes: a first buffer contact on a substrate; a second buffer contact on the substrate, the second buffer contact being on a same wiring level as the first buffer contact; a resistive film contacting the first buffer contact and the second buffer contact, the resistive film extending on the substrate between the first buffer contact and the second buffer contact; and electrical contacts landing on both the first buffer contact and the second buffer contact, but not directly contacting with the resistive film.

Integrated thin film resistor and metal-insulator-metal capacitor

A semiconductor device may be provided, including a substrate which includes a first semiconductor layer having a well region arranged within the first semiconductor layer, a buried insulator layer arranged over the first semiconductor layer, and a second semiconductor layer arranged over the buried insulator layer. The semiconductor device may include a capacitive structure including: the well region, at least one contact to the well region, at least a portion of the buried insulator layer over the well region, at least a portion of the second semiconductor layer, a source region and a drain region arranged over the second semiconductor layer, a gate dielectric layer arranged over the second semiconductor layer and arranged laterally between the source region and the drain region, and a gate layer arranged over the gate dielectric layer. The well region, the source region, and the drain region may have the same conductivity type.

Semiconductor device having a capacitive structure and method of forming the same

According to various embodiments, a semiconductor device may include a thin film arranged within a first inter-level dielectric layer, a masking region, and a contact plug. The masking region may be arranged over the thin film, within the first inter-level dielectric layer. The masking region may be structured to have a higher etch rate than the first inter-level dielectric layer. The contact plug may extend along a vertical axis, from a second inter-level dielectric layer to the thin film. A bottom portion of the contact plug may be surrounded by the masking region. The bottom portion of the contact plug may include a lateral member that extends along a horizontal plane at least substantially perpendicular to the vertical axis. The lateral member may be in contact with the thin film.

Thin film based semiconductor devices and methods of forming a thin film based semiconductor device

E-fuse cells and methods for protecting e-fuses are provided. An exemplary e-fuse cell includes an e-fuse having a first end coupled to a source node and a second end selectively coupled to a ground. Further, the exemplary e-fuse includes a selectively activated shunt path from the source node to the ground. Also, the exemplary e-fuse includes a device for activating the shunt path in response to an electrical overstress event.

E-fuse cells

Integrated circuits (ICs) include electrostatic discharge protection including a transistor having a drain operably coupled to a first rail of the integrated circuit and a source operatively coupled to a second rail of the integrated circuit. A voltage regulating trigger circuit is operatively coupled to the first rail and to a gate of the transistor to turn on of the transistor responsive to an ESD event affecting the integrated circuit, wherein the voltage regulating trigger circuit limits a potential of the first rail to a first potential and a gate potential of the transistor to a second potential, less than the first potential but sufficient to turn the transistor on to conduct current arising from the ESD event from the first rail to the second rail.

Integrated circuit electrostatic discharge protection

Integrated circuits and methods of producing integrated circuits are provided. In an exemplary embodiment, an integrated circuit includes a source and a drain defined within a body isolation well. A gate overlies the body isolation well between the source and the drain, and an isolating structure is formed within the body isolation well. The isolating structure sections the source into a plurality of source sections with the plurality of source sections adjacent to one gate.

Integrated circuits with high current capacity and methods for producing the same

Devices and methods of forming an integrated circuit (IC) that offer protection against ESD in high voltage (HV) circuit applications are disclosed. A device includes N ones of a field effect transistor (FET) stacked in series to provide an N-level stack, where N is an integer greater than 1. A first pad of the device is coupled to a first FET and a second pad is coupled to an Nth FET. The device also includes a stacked/distributed RC control circuit configured to cause a short circuit between the first pad and the second pad in response to an ESD event. During the ESD event, the RC control circuit is configured to concurrently provide sufficient voltage to control the N ones of the FET by turning them on using parasitic conduction to cause the short circuit.

RC-stacked MOSFET circuit for high voltage (HV) electrostatic discharge (ESD) protection

An RC-based electrostatic discharge protection device provides an extended snapback trigger voltage range, thereby avoiding latch-up. Two parallel current discharge paths are provided between supply terminals during an electrostatic discharge event by virtue of an added external resistor. The first current discharge path includes body resistance of the protection device and the second current discharge path includes the external resistor.

Latch-up free RC-based NMOS ESD power clamp in HV use

A triple stack NMOS integrated circuit structure protection circuit for a plurality of terminals operative at respective voltage levels is coupled between the plurality of terminals. First and second NMOS elements of the triple stack NMOS share a common active region. A third NMOS element, vertically positioned with respect to the first and second NMOS elements, has an active region separate from the active region of the first and second NMOS elements. The first, second and third NMOS elements are connected in series between two terminals of the plurality of terminals.

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Singapore, Singapore

Handoko Linewih