Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

Hanako Yori

Takashi Masuko

Tomoaki Shibata

Tomonori Minegishi

Hidenori Abe

Shunsuke Otake

Masahiko Ogino

Makoto Kaji

Ken Sawabe

Yasuharu Murakami

Tetsuya Kato

Masahiro Miyasaka

Tatsuya Ichikawa

Takashi Kumaki

Kenichi Iwashita

Junichi Iso

Takeshi Ohashi

Manabu Saitou

A resin film includes a resin composition for forming a flexible resin layer. The resin composition includes an elastomer, a polymerizable compound, and a polymerization initiator. A laminated film includes a base material film, a resin film formed on the base material film, and a protective film attached to the resin film.

Resin film, and laminated film including base material film, resin film formed on base material film, and protective film attached to resin film

Disclosed is a method for producing a semiconductor device including a circuit board having a flexible resin layer that encapsulates a circuit component. The method may include a step of immersing a flexible substrate in an encapsulant, drying the encapsulant, and thereby encapsulating the circuit component with the encapsulant; and a step of curing the encapsulant, and thereby forming a flexible resin layer.

Method for producing semiconductor device

Semiconductor device and manufacturing method therefor, and resin composition for forming flexible resin layer

Provided is a photosensitive resin composition comprising (A) a resin having a phenolic hydroxyl group; (B) an aliphatic or alicyclic epoxy compound having two or more oxirane rings; (C) a photosensitive acid generator; and (D) a solvent; wherein the photosensitive resin composition comprises 20 to 70 parts by mass of the component (B) relative to 100 parts by mass of the component (A).

Photosensitive resin composition, photosensitive film, and method for forming resist pattern

A photosensitive element comprises a support, a photosensitive layer and a protective film laminated in that order, wherein the photosensitive layer is composed of a photosensitive resin composition containing a binder polymer, a photopolymerizing compound, a photopolymerization initiator and a compound with a maximum absorption wavelength of 370-420 nm, and the protective film is composed mainly of polypropylene.

Photosensitive element, method for formation of resist pattern, and method for production of print circuit board

A photocurable resin composition containing a photopolymerization initiator and a (meth)acrylate monomer and/or oligomer, said (meth)acrylate monomer or oligomer having a cyclic structure, in which the atomic weight of carbon (Mcr) in said cyclic structure and the number of whole carbon atoms (MTOT) in said composition have the relation of Mcr/MTOT&#x3e;0.1, or the total number (N) of carbon atoms in said cyclic structure, the total number of carbon atoms (Nc) in said composition and the total number of oxygen atoms (No) have the relation of N/(Nc&#x2212;No)&#x3c;4, and the composition has a kinetic viscosity of 10 mPa&#xb7;s or below. This low-viscosity photocurable resin composition has excellent dry etching resistance and is applicable to optical nanoprinting.

Photocurable resin composition and a method for forming a pattern

Provided is a new photo-curable resin composition which can be used in a photo nanoimprinting technology available for a photo nanoimprinting technology by which a substrate is processed with high accuracy. The photo-curable resin composition contains a photo-curable resin material essentially containing a (meth)acrylate, a reactive diluent, and a photo initiator. Preferably, the (meth)acrylate has a structure containing a benzene ring structure in its skeleton.

Photo-curable resin composition and a method for forming a pattern using the same

A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound with an ethylenic unsaturated bond, (C) a photopolymerization initiator and (D) a compound represented by the following general formula (1) or (2). [Chemical Formula 1] [wherein X, X, X, X, Xand Xeach independently represent a CH group, CCHgroup, CCHgroup or nitrogen, Y, Y, Yand Yeach independently represent optionally substituted aryl, and Yrepresents optionally substituted arylene].

Photosensitive resin composition, photosensitive element, resist pattern forming method and process for manufacturing printed circuit board

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Hitachi, Japan

Hanako Yori