Hitachi, Ltd.

Renesas Electronics Corporation

Renesas Technology Corp.

Hanae Hata

Tasao Soga

Tetsuya Nakatsuka

Masahide Okamoto

Toshiharu Ishida

Kazuma Miura

Nobuhiro Kinoshita

Hirokazu Nakajima

Tsuneo Endoh

Chiko Yorita

Mikio Negishi

Jumpei Konno

Masato Nakamura

Kanko Ishida, Legal Representative

In order to achieve the highly reliable and highly functional semiconductor device capable of the high-speed transmission by stacking thin chips and substrates, a connecting process and a connecting structure capable of making a solid connection at a low temperature with a low load and maintaining the shape of a connecting portion even if the connecting portion is heated in the stacking process and the subsequent mounting process are provided. In a semiconductor device in which semiconductor chips or wiring boards on which semiconductor chips are mounted are stacked, a connecting structure between electrodes of the stacked semiconductor chips or wiring boards includes a pair of electrodes mainly made of Cu and a solder layer made of Sn&#x2014;In based alloy sandwiched between the electrodes, and Sn&#x2014;Cu&#x2014;Ni intermetallic compounds are dispersed in the solder layer.

Semiconductor device and manufacturing method of the same

A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.

Solder foil, semiconductor device and electronic device

In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.

Solder

There is provided an electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a joint comprising a phase of Al particles and another phase of a Al&mdash;Mg&mdash;Ge&mdash;Zn alloy, said Al particles being connected to each other by said Al&mdash;Mg&mdash;Ge&mdash;Zn alloy phase.

Product using Zn-Al alloy solder

Growing community of inventors

Yokohama, Japan

Hanae Hata