Technic, Inc.

Hana Marcella Hradil

Edward Frank Hradil

George Hradil

Alfred M Weisberg

The invention provides an electroplating composition, method, and improved apparatus, which enables electroplating tin-silver alloys at high speed and without burning. The composition is an aqueous acidic solution including salts of stannous tin and a monovalent silver, and a complexing agent selected from the group consisting of thiocarbazides and thiohydrazides, and optionally an aldehyde and/or dialdehyde organic brightener compound. A sulfonic acid and a surfactant may also be included. The improved apparatus provides a protective structure substantially surrounding the anode(s) to decrease turbulence and the problematic silver displacement reaction.

Electrolyte composition, method, and improved apparatus for high speed tin-silver electroplating

The invention relates to an electrolyte used in connection with the deposition of a gold-tin alloy on an electroplatable substrate. This solution generally includes water; stannous and/or stannic tin ions, a complexing agent to render the stannous and/or stannic tin ions soluble, complexed gold ions, and an alloy stabilizing agent that includes ethoxylated compounds with phosphate ester functional group, brightening additives based on ethoxylated phosphate esters and alkali metal fatty acids dipropionates. The brighteners may be used alone or in conjunction with each other to achieve beneficial synergistic effect. The alloy stabilizing agent is present in an amount sufficient to stabilize the composition of the gold-tin deposit over a usable current density range. The solution has a pH of between 2 and 10 and the gold ions and tin ions are present in relative amounts sufficient to provide a deposit having a gold content less than 90% by weight and a tin content greater than 10% by weight.

Electroplating solution for gold-tin eutectic alloy

A silver and silver alloy electroplating bath; electrolytic solution; water-soluble silver complex for incorporation therein; and the process for electrodeposition of silver and silver alloys; wherein the electrolytic solution and bath have a pH of at least 6, is free of cyanide, and comprises a water-soluble complex formed from the reaction of a silver salt or compound and an organic complexing agent selected from a pyrrolidine-2,5-dione or a 3-pyrroline-2.5-dione.

Non-cyanide bright silver electroplating bath therefor, silver compounds

A non-cyanide silver and silver-alloy electroplating bath composed of silver salts with imides of organic dicarboxylic acids which form a useful complex. Alloy deposits of silver with up to 5 percent of Copper, Cadmium, Gold, Antimony, Palladium and similar related metals can be prepared.

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St. Petersburg, FL, United States of America

Hana Marcella Hradil