Tron Future Tech Inc.

National Yang Ming Chiao Tung University

Han-Wen Hu

Yu-Jiu Wang

Li Han Chang

Yi-Chieh Tsai

Kuan-Neng Chen

Demin Liu

An antenna package is provided. The antenna package includes a glass substrate, a plurality of antennas, a multi-layer circuit structure, and a plurality of radio frequency chips. The glass substrate has a first surface and a second surface. The plurality of antennas are arranged on the first surface of the glass substrate. The multi-layer circuit structure has a first surface and a second surface. The plurality of radio frequency chips are arranged on the first surface of the multi-layer circuit structure. The second surface of the glass substrate is adhered to the second surface of the multi-layer circuit structure.

Antenna package and method for manufacturing an antenna package

An antenna package structure is provided. The antenna package structure includes a glass substrate, an interconnect structure, a plurality of semiconductor chips, and an antenna array structure. The glass substrate has a first surface and a second surface opposite to the first surface. The interconnect structure is disposed over the first surface of the glass substrate. The plurality of semiconductor chips are mounted over the interconnect structure. The antenna array structure is formed on the second surface of the glass substrate. Furthermore, the plurality of semiconductor chips are coupled to the antenna array structure through the interconnect structure and the glass substrate.

Antenna package structure

A bonding element and a method for manufacturing the same thereof are provide, wherein the method comprises the following steps: providing a carrier substrate; forming a first metal layer on the carrier substrate; forming a first insulating layer on the first metal layer, wherein the first insulating layer includes a first through hole; forming a first passivation layer and a first conductive layer in the first through hole, wherein the first passivation layer and the first conductive layer in the first through hole form a first connecting bump; forming a first substrate on the first connection bump and the first insulating layer; removing the carrier substrate and the first metal layer to form a first sub-bonding element; and connecting the first sub-bonding element and a second sub-bonding element with a surface of the first passivation of the first connection bump to form the bonding element.

Growing community of inventors

Hsinchu County, Taiwan

Han-Wen Hu