First International Computer, Inc.

Han-Tun Chen

Ting-Chiang Huang

Ben Hung-Ping Shen

Chei-Ju Tsai

An airflow guide structure and manufacture thereof is used to allow components of an airflow guide are cut by molds in a factory to form thin plates in each of which has a plurality of bendable lines, and transported into a mainframe assembly plant to store therein. Each component of the airflow guide is folded into a three-dimensional type at a production line when a mainframe wants to be assembled. Because each component of the airflow guide is a thin plate and lighter in weight, it can be stacked together with another component before a three-dimensional cover body is assembled. Therefore, the space is saved and the transportation and storage are more convenient.

Growing community of inventors

Taipei, Taiwan

Han-Tun Chen