Samsung Electro-mechanics Co., Ltd.

Skc Co., Ltd.

Information and Communication Univerity Research and Industrial Cooperation Group

Infomation and Communications University Research and Industrial Cooperation Group

Han Seo Cho

Jae Hyun Jung

Joon Sung Kim

Sang Hoon Kim

Sang-Hoon Kim

Je-Gwang Yoo

Joon-Sung Kim

Mu Hee Cho

Jong Ho Lee

Doo Hwan Lee

Sang Huk Kim

Kyung Rok Kim

Chang Sup Ryu

Hyo-Hoon Park

Hyo Hoon Park

Je Gwang Yoo

Hwa Sun Park

Jong Ha Park

Seung Gu Kim

Sung Hwan Hwang

Disclosed herein is a printed circuit board for an optical waveguide, including: a lower substrate; an insulation layer which has a through-hole and is formed on the lower substrate; an optical waveguide which is formed in the through-hole such that a clearance is present between the optical wave guide and an inner wall of the through-hole; and an adhesive material which is charged in the clearance. The printed circuit board for an optical waveguide is advantageous in that a lower clad material, a core material and an upper clad material are sequentially applied on the lower substrate partially, not entirely, based on the region in which a core is formed, and is then patterned to form an optical waveguide, so that the amounts of the lower and upper clad materials and the core material, which are used to form the optical waveguide, can be greatly decreased.

Printed circuit board for optical waveguides and method of manufacturing same

The present invention provides an optical flexible printed circuit board comprising: a base layer; an optical waveguide pattern disposed on a partial region of the base layer; an insulating layer which is disposed on the base layer with the optical waveguide pattern and has a surface profile bent by the optical waveguide pattern; and circuit wires disposed on one surface of the base layer.

Optical flexible printed circuit board with optical waveguides and method manufacturing the same

A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

Printed circuit board and manufacturing method thereof

Disclosed herein is a printed circuit board for an optical waveguide, including: a substrate; an insulation layer having a through hole and formed on the substrate; a lower clad layer formed on a bottom of the through hole; core part formed on the lower clad layer; and an upper clad layer formed on the lower clad layer and the core part and thus covering an exposed surface of the core part.

Printed circuit board for optical waveguide and method of manufacturing the same

Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

A method of manufacturing a printed circuit board for optical waveguides, including: preparing a base substrate; forming an optical waveguide, which includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core, on an upper middle of the base substrate; disposing a side substrate including a first side substrate that has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a first circuit pattern formed therein and a second side substrate disposed on the first side substrate on the upper part of the base substrate on which the optical waveguide is formed; disposing an upper substrate on the side substrate on which the through hole is formed; and stacking the side substrate and the upper substrate on the base substrate on which the optical waveguide is formed.

Method of manufacturing printed circuit board for optical waveguides

The present invention relates to a printed circuit board for optical waveguides and a method of manufacturing the same. The present invention provides a printed circuit board for optical waveguides includes: a base substrate; an optical waveguide that is formed on an upper middle of the base substrate and includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core; and a side substrate that is formed on the base substrate and has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a circuit pattern formed therein and a method of manufacturing a printed circuit board for optical waveguides.

Printed circuit board for optical waveguides and method of manufacturing the same

A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.

Method of manufacturing printed circuit board

A printed circuit board including an optical waveguide and a method of manufacturing the board. In the board, the optical waveguide includes a metal layer extending portion integrally connected to a metal layer constituting a mirror formed in the optical waveguide. Since the method creates the mirror using electroless plating, which is typically used in a process of manufacturing general printed circuit boards, it is suitable for the manufacture of printed circuit boards having a large area, and the mirror has high reflectivity and is efficient in terms of material consumption.

Printed circuit board including optical waveguide and method of manufacturing the same

A printed circuit board and a method of manufacturing a printed circuit board are disclosed. A printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.

Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S), step for forming mounting holes in the insulating member (S), step for mounting the electronic component on the insulating member to meet the position-setting means and the mounting holes (S), step for forming copper cladding coated with an adhesive on the insulating member (S), step for applying heat and/or pressure to the copper cladding (S), and step for forming a via-hole in the copper cladding to be electrically connected to the electronic component, and step for forming a circuit pattern in the copper cladding (S). The step (S) can comprise a step (S) for applying inter-adhesive on respective surfaces of the insulating member, and a step (S) for applying copper cladding on respective surfaces of the inter-adhesive.

Method for manufacturing circuit board with built-in electronic components

Disclosed is an optical printed circuit board (PCB) having a multi-channel optical waveguide, which comprises: an optical waveguide having an optical path for transmitting light beams; a groove for penetrating the optical waveguide; and an optical interconnection block inserted in the groove and connected to the optical waveguide to transmit the light beams, wherein the optical interconnection block includes an optical fiber bundle bent by the angle of 90&#xb0;. The optical interconnection block connects a plurality of multi-layered optical waveguides to transmit light beams to the optical waveguides. The optical fiber bundle is installed as a medium of the multi-channel optical waveguide in the optical PCB.

Growing community of inventors

Daejeon, South Korea

Han Seo Cho