Unimicron Technology Corporation

Han-Pei Huang

Cheng-Po Yu

Pei-Chang Huang

Cheng-Hung Yu

Wei-Ming Cheng

Chih-Peng Fan

Cheng-Ming Weng

Ai-Hwa Lim

A wiring board includes a substrate, a first conductor layer, a second conductor layer, and a through-via conductor. The substrate has a first surface, a second surface, and at least one through-via. The first conductor layer is formed on the first surface, and the second conductor layer is formed on the second surface. The through-via conductor is formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer. The through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. The first depressed portion and the second depressed, portion are non-coaxial.

Touch member and method of manufacturing the same

A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having two surfaces opposite to each other and a via connecting there between is provided. Next, a patterned circuit layer is formed on each of the surfaces by using the via as an alignment target. Each patterned circuit layer includes a concentric-circle pattern. Next, a first stacking layer is formed on each of the surfaces. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. Next, a second stacking layer is formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Manufacturing method for multi-layer circuit board

A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having a first via penetrating the substrate is provided. Next, a patterned circuit layer is formed on a surface of the substrate by using the first via as an alignment target. The first patterned circuit layer includes a first concentric-circle pattern surrounding the first via. Next, a first stacking layer is formed on the surface. Then, a first through hole penetrating regions where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected on the first stacking layer and the substrate is formed. Next, a second stacking layer is formed on the first stacking layer. Afterward, a second through hole penetrating regions where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected on of the first, the second stacking layers and the substrate is formed.

A dianhydride monomer having a large side chain R is provided. The large side chain would interrupt the symmetry and regularity of diamine monomer. The diamine monomer has the general formula shown as formula (I) below:  The functional group R includes &#x3b1;-substitution cycloalkene having at least a tertiary carbon atom, cycloalkene having at least a tertiary carbon atom, cycloalkane having at least a tertiary carbon atom, &#x3b1;-substitution phenyl, phenyl, &#x3b1;-substitution naphthalyl, naphthalyl, &#x3b1;-substitution phenanthrenyl, phenanthrenyl, &#x3b1;-substitution anthracenyl, anthracenyl, &#x3b1;-substitution adamantyl, adamantyl, &#x3b1;-substitution adamantyl and adamantyl.

Dianhydride monomer having side chain, polyimide compound having side chain and manufacturing method thereof

A polyimide compound with a large side chain R and R' is provided. The large side chain would interrupt the symmetry and regularity of polyimide compound. The polyimide compound has the general formula shown as formula (I) below:  The functional group R and R&#x2032; are selecting individually from the group consisting: &#x3b1;-substitution cycloalkene with at least a tertiary carbon atom, cycloalkene with at least a tertiary carbon atom, cycloalkane with at least a tertiary carbon atom, &#x3b1;-substitution phenyl, phenyl, &#x3b1;-substitution naphthalyl, naphthalyl, &#x3b1;-substitution phenanthrenyl, phenanthrenyl, &#x3b1;-substitution anthracenyl, anthracenyl, &#x3b1;-substitution adamantyl, adamantyl, &#x3b1;-substitution diamantyl and diamantyl.

Polyimide compound having side chain and manufacturing method thereof

A method of fabrication a circuit board structure comprising providing a circuit board main body, forming a molded, irregular plastic body having a non-plate type, stereo structure and at least one scraggy surface by encapsulating at least a portion of said circuit board main body with injection molded material, and forming a first three-dimensional circuit pattern on said molded, irregular plastic body thereby defining a three-dimensional circuit device.

Method of fabricating circuit board structure

A multilayer three-dimensional circuit structure and a manufacturing method thereof are provided in the present invention. The manufacturing method includes following steps. First, a three-dimensional insulating structure is provided. A first three-dimensional circuit structure is then formed on a surface of the three-dimensional insulating structure. Next, an insulating layer covering the first three-dimensional circuit structure is formed. Thereafter, a second three-dimensional circuit structure is formed on the insulating layer. Subsequently, at least a conductive via penetrating the insulating layer is formed for electrically connecting the second three-dimensional circuit structure and the first three-dimensional circuit structure.

Multilayer three-dimensional circuit structure and manufacturing method thereof

A chip package carrier is disclosed, which includes a first circuit layer, a second circuit layer, a core layer, a third circuit layer, a first dielectric layer between the first and third circuit layers, a fourth conductive layer including at least a solder ball pad, a second dielectric layer between the second and fourth circuit layers and at least a capacitor device, wherein the core layer has at least a first through-hole; the third circuit layer is disposed above the first circuit layer and includes at least a die pad; the capacitor device is disposed in the first through-hole. The capacitor device herein includes a first pillar electrode covering the wall of the first through-hole, a cylindrical capacitor material disposed in the first pillar electrode and having a first blind hole, and a second pillar electrode disposed in the first blind hole and connected to the die pad.

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Taoyuan County, Taiwan

Han-Pei Huang