Samsung Electronics Co., Ltd.

Han-Na Cho

Bok-Yeon Won

Oik Kwon

Jongchul Park

Jong-Kyu Kim

Hyuk Kim

Jung-Ik Oh

Seong-Soo Lee

Dae-Hyun Jang

O-Ik Kwon

Hye-Ji Yoon

A magnetic memory device includes a substrate including a cell region and a peripheral circuit region, lower contact plugs on the cell region, data storage structures on the lower contact plugs, and a peripheral interconnection structure on the peripheral circuit region. The peripheral interconnection structure includes a line portion extending in a direction parallel to a top surface of the substrate, and contact portions extending from the line portion toward the substrate. A height of each of the contact portions is less than a height of each of the lower contact plugs.

Magnetic memory devices

A method of manufacturing an MRAM device including forming a first insulating interlayer and a lower electrode contact, the lower electrode contact extending through the first insulating interlayer; forming a lower electrode layer, a magnetic tunnel junction layer, an upper electrode layer, and a first hard mask layer on the first insulating interlayer and lower electrode contact; forming a second hard mask on the first hard mask layer; etching the first hard mask layer and upper electrode layer to form a first hard mask and upper electrode; forming a spacer on sidewalls of the upper electrode and hard masks; and etching the magnetic tunnel junction layer and the lower electrode layer to form a structure including a lower electrode and a magnetic tunnel junction pattern on the lower electrode contact, wherein a layer remains on the upper electrode after etching the magnetic tunnel junction layer and the lower electrode layer.

Method of manufacturing a magnetoresistive random access memory device using hard masks and spacers

An ion beam etching device comprises: an ion source configured to generate ions; a grid on a side of the ion source, the grid configured to accelerate the generated ions to generate an ion beam; a process chamber configured to have an etching process using the ion beam performed therein; and a variable magnetic field application part adjacent to the process chamber, the variable magnetic field application part configured to apply a variable magnetic field.

Ion beam etching devices

A method of forming a multi-floor step pattern structure includes forming a stacked structure having alternating insulating interlayers and sacrificial layers on a substrate. A first photoresist pattern is formed on the stacked structure. A first preliminary step pattern structure is formed by etching portions of the stacked structure using the first photoresist pattern as an etching mask. A passivation layer pattern is formed on upper surfaces of the first photoresist pattern and the first preliminary step pattern structure. A second photoresist pattern is formed by removing a side wall portion of the first photoresist pattern exposed by the passivation layer pattern. A second preliminary step pattern structure is formed by etching exposed insulating interlayers and underlying sacrificial layers using the second photoresist pattern as an etching mask. The above steps may be repeated on the second preliminary step pattern structure to form the multi-floor step pattern structure.

Method of forming a step pattern structure

Growing community of inventors

Seongnam-si, South Korea

Han-Na Cho