Microsoft Technology Licensing, LLC

Han Li

Bo Dan

James David Holbery

David John Huston

Joseph Benjamin Gault

Siyuan Ma

Masaaki Fukumoto

Andrew William Hill

Jaejin Lee

James Michael Bonicatto

Scott Douglas Bowers

Lincoln Matthew Ghioni

Kenneth Charles Boman

Brian Joseph Toleno

Nathan Michael Thome

Kanth Kurumaddali

Robert Ullman Myers

Zhicong Yao

James Hao-An Chen Lin

Sahar Vilan

Massood Nikkhah

Paul Christopher Kos

Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.

Conformal electromagnetic interference shielding film

A method of controlling opening resistance in an electronic device includes maintaining the electronic device in a closed state via a resistive force, wherein the resistive force is applied by at least one of: a hinge of the electronic device, and magnets of the electronic device. The method further includes using a sensor on an underside of the electronic device to detect a force applied to a first portion of the electronic device and determining that the force corresponds to a user initiating opening of the electronic device. In accordance with the determination, the method further includes reducing the resistive force to assist the user in opening the electronic device.

Systems and methods for dynamically adjusting opening force

A method of manufacturing an electronic device housing includes obtaining a monolithic body of RF transparent material and plating a surface of the monolithic body with a nanograin coating to increase the structural rigidity of the monolithic body. A portion of the nanograin coating is thereafter removed to create an RF window.

Systems and methods for manufacturing electronic device housings

The present description relates to flexible hinges and hinged devices. One example device includes a first portion and a second portion. The example also includes a relieved flexible hinge rotatably securing the first and second portions.

Flexible hinge device

A vapor chamber device is provided. The vapor chamber device includes a heat-generating component, a first metallic layer deposited directly on the heat-generating component, and a second metallic layer deposited so as to contact the first metallic layer at a perimeter. The first and second metallic layers fully enclose an internal void formed therein.

Vapor chamber on heat-generating component

Thermal management devices and systems, and corresponding methods of cooling computing devices are described herein. Such devices, systems, and methods may be advantageous in providing optimal thermal management for the computing device and/or minimizing acoustics in the computing device for a plurality of rotational fan speeds. Additionally, optimal thermal management may provide an increase in system performance and an increase in computing device life expectancy. In one example, a thermal management system includes a fan configured to move air through an outlet opening of the fan and at least one airflow guide positioned adjacent to the outlet opening. The at least one airflow guide is configured to direct movement of the air from the outlet opening to dissipate heat within an electronic device, and the at least one airflow guide is configured to pivot about an axis to move between a first position to a second position based on a change in a rotational speed of the fan.

Adaptive airflow guides in an electronic device

An electronic device with a magnetically attached electronic component is described herein. An electronic device includes a housing and an electronic component. The electronic component is positioned within the housing and magnetically attached to an internal surface of the housing via a magnetic force between the electronic component and the internal surface of the housing. During manufacturing, the electronic component can be magnetically attached to the internal surface of the housing by aligning one or more magnetic attachment points of the electronic component within magnetic proximity to one or more corresponding magnetic attachment points of the internal surface of the housing of the electronic device to magnetically attach the electronic component to the internal surface of the housing.

Electronic device with a magnetically attached electronic component

Touchscreen computing devices are often assembled by applying an adhesive to an interface perimeter between a cover glass and a chassis. Occasionally, a device is de-bonded to troubleshoot errors in the functionality of the device. The adhesive often is resistant to releasing the bond between the cover glass and a chassis by mechanical force and the cover glass may be damaged during disassembly. Passive and/or active de-bonding aids facilitate transfer of thermal energy to the adhesive in a manner that avoids or minimizes the transfer of thermal energy to heat-sensitive components of the device.

Growing community of inventors

Sammamish, WA, United States of America

Han Li