Samsung Electronics Co., Ltd.

Han Kook Cho

Jae Hong Kim

Seog Heon Ham

Dong Hun Lee

Seung Hyun Lim

Dong Jin Kim

Jin Ho Seo

Kwi Sung Yoo

Ha Yong Jung

Ji Hye Shim

Yu Jin Park

Jae Min Choi

Jae Kul Lee

Woon Chui Choi

Sung Taek Woo

Jin Uk Jeon

Min Ji Hwang

Wun Ki Jung

An image sensor and an image processing system including the same are provided. The image sensor includes a pixel array including a plurality of pixels each connected to one of first through m-th column lines to output a pixel signal, where 'm' is an integer of at least 2; analog-to-digital converters each configured to receive the pixel signal corresponding to one of the first through m-th column lines, to compare the pixel signal with a ramp signal, and to convert the pixel signal to a digital pixel signal; and a blocking circuit connected to an input terminal of at least one of the analog-to-digital converters to block an influence of an operation of others among the analog-to-digital converters.

Image sensor for improving linearity of analog-to-digital converter and image processing system including the same

A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.

Fan-out semiconductor package

An image sensor for reducing channel variation and an image processing system including the same. The image sensor includes first to mpixels (m&#x2267;2), each of which is connected to a corresponding column line from among first to mcolumn lines and is configured to output a respective pixel signal.' The image sensor further includes first to mbias circuits, each of which is connected to a corresponding column line from among the first to mcolumn lines and is configured to fix a voltage of the corresponding column line to a bias voltage when a column line-specific pixel is not selected to output the respective pixel signal. An analog-to-digital converter in the image sensor is configured to convert the pixel signals into digital signals.

Image sensor for reducing channel variation and image processing system including the same

An analog-to-digital converter includes a gain amplification unit configured to receive a pixel signal at a first node and to amplify a gain of the pixel signal, a first capacitor connected between the first node and a second node, an amplifier configured to receive and amplify a signal output from the gain amplification unit and the first capacitor, and a conversion circuit configured to convert an output signal of the amplifier to a digital signal based on a reference signal and output the digital signal as a first output signal.

Analog-to-digital converter, image sensor including the same, and image processing device including the image sensor

Growing community of inventors

Suwon-si, South Korea

Han Kook Cho