Korea Advanced Institute of Science and Technology

Center for Integrated Smart Sensors Foundation

Han Eol Lee

Keon Jae Lee

Jung Ho Shin

Sang Hyun Park

Tae Jin Kim

Do Hyun Kim

Seong Kwang Hong

The present disclosure provides a method for transfer and assembly of RGB micro-light-emitting diodes using vacuum suction force whereby the vacuum state of micrometer-sized adsorption holes to which micro-light-emitting diodes formed on a mother substrate or a temporary substrate are bonded is controlled selectively, so that only the micro-light-emitting diode devices desired to be detached from the mother substrate or the temporary substrate are detached from the mother substrate or the temporary substrate using vacuum suction force and then transferred to a target substrate.

Layout structure between substrate, micro-LED array and micro-vacuum module for micro-LED array transfer using micro-vacuum module, and method for manufacturing micro-LED display using the same

A laminating structure of an electronic device using a transferring element according to the present disclosure includes a target substrate, a bottom electrode formed on the target substrate, an electronic device which is bonded to the bottom electrode, a top contact formed on the electronic device, a transferring element which is placed between the bottom electrode and the electronic device on the target substrate, and a top electrode connected to the electronic device, wherein the transferring element attached to the carrier substrate comes into contact with the electronic device, and is then transferred onto the target substrate.

Laminating structure of electronic device using transferring element, transferring apparatus for fabricating the electronic device and method for fabricating the electronic device

Growing community of inventors

Daejeon, South Korea

Han Eol Lee