Virginia Tech Intellectual Properties, Inc.

Toyota Motor Engineering & Manufacturing North America, Inc.

Han Cui

Chi-Ming Wang

Khai Ngo

Khai Doan The Ngo

The present invention is directed to a compact inductor having the required (predetermined) inductance and current rating, further designed to avoid substantial heat generation by avoiding saturation, winding(s) possessing a low DC resistance and copper loss, and minimizing the required volume or profile in order to conserve circuit board real-estate. The compact inductor design of the present invention includes both enclosed core as well as enclosed winding type of inductor designs.

Compact inductor employing redistributed magnetic flux

A power device package includes a dielectric substrate having an upper conductor layer and a lower conductor layer, a semiconductor die coupled to the upper conductor layer of the dielectric substrate via conductive adhesive, a cooler including a protruding hillock having a top surface and outer sides, the lower conductor layer of the dielectric substrate being coupled to the surface of the protruding hillock via an adhesive, and a magnetic material attached mateably around the protruding hillock. The magnetic material includes inner sides abutting the outer sides of the protruding hillock.

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Blacksburg, VA, United States of America

Han Cui