Tripod Technology Corporation

Han-Ching Shih

Wei-Hsiung Yang

Bo-Shiung Huang

Cheng-Feng Lin

Tzu-Yuan Fan

Kai-Hsiang Chen

A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.

Printed circuit board package structure and manufacturing method thereof

A printed circuit board package structure includes a substrate having a first surface and a second surface, a ring-shaped magnetic element, an adhesive layer, conductive portions and conductive channels. The first and second surfaces respectively have first and second metal portions. A ring-shaped concave portion is formed on a position not covered by the first metal portions of the first surface. The ring-shaped magnetic element is placed in the ring-shaped concave portion. The adhesive layer covers the first metal portions and the ring-shaped magnetic element. The conductive portions are formed on the adhesive layer. The conductive channels penetrate the conductive portions, the adhesive layer, and the substrate, and are respectively located in an inner wall and outside an outer wall of the ring-shaped concave portion. Each of the conductive channels includes a conductive film electrically connects to the aligned conductive portion and second metal portion.

A method of embedding a magnetic component in a substrate is disclosed. Holes are formed in a substrate by mechanically drilling. Each of the holes includes a top opening, a bottom and sidewall, wherein an area of the top opening is larger than that of the bottom. The sidewall extends from the top opening vertically downwards to a predetermined depth, and then is slanted inwardly to the bottom to form a sloped sidewall at the bottom of the hole. A predetermined region is defined along a portion of an edge of the top opening, and a portion of the substrate material under the predetermined region is removed by routing to form a component accommodation trench with a portion of the sloped sidewall at the bottom. Then, a magnetic component is placed into the component accommodation trench.

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Taoyuan County, Taiwan

Han-Ching Shih