Pulse Electronics Gmbh

Pulse Engineering, Inc.

Hamlet Abedmamoore

Thuyen Dinh

Mohammad Saboori

Peter John Gutierrez, Iii

Henry Jean

David Thanh Phan

Mark Greene

An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Integrated connector modules for extending transformer bandwidth with mixed-mode coupling using a substrate inductive device

A low cost, low profile, small size and high performance electronic device for use in, e.g., electronic circuits where a transformer, inductor, or mixer is required. In one exemplary embodiment, the device includes a 'binocular' ferrite core comprising a plurality of core apertures and windings. The core is shaped with one or more channels which are at least partly plated (metallized) so as to allow bonding of the winding terminations directly to the core. The placement of these plated areas allows simplified surface mounting. The plated areas also obviate a termination header, thereby simplifying the manufacture of the device and reducing its cost. Methods for manufacturing the device are also disclosed.

Simplified surface-mount devices and methods

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San Diego, CA, United States of America

Hamlet Abedmamoore