Intel Corporation

Adeia Semiconductor Bonding Technologies Inc.

Stats Chippac Pte. Ltd.

Invensense, Inc.

Hamid Eslampour

Ut Tran

Achintya K Bhowmik

Nagesh K Vodrahalli

Ruolin Li

William Wong

Hai-Feng Liu

Gennady Farber

Jesper Arentoft Jayaswal

Belgacem Haba

Heap Hoe Kuan

Rui Huang

DaeSik Choi

Konstantine N Karavakis

Karthik Katingari

Taeg Ki Lim

Jesper Jayaswal-Arentoff

Adam Martin

Jesper Jayaswal-Arentoft

A semiconductor package with design features, including an isolation structure for internal components and a flexible electrical connection, that minimizes errors due to environmental temperature, shock, and vibration effects. The semiconductor package may include a base having a first portion surrounded by a second portion. A connector assembly may be attached to the first portion. The connector assembly may extend through an opening in the base. A lid attached may be attached to, at least, the second portion. The attached lid may form a hermetically-sealed cavity defined by an upper surface of the first portion, the connector assembly, and an inner surface of the lid. An elastomer pad may be on the first portion and a sub-assembly may be on the elastomer pad. A flexible electrical connection may be formed between the connector assembly and the sub-assembly.

Semiconductor package with built-in vibration isolation, thermal stability, and connector decoupling

A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts and an integrated circuit; providing a structure over the substrate with only a honeycomb meshwork of posts contacting the top surface of the substrate; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that expose the electrical contacts.

Integrated circuit package system including honeycomb molding

Embodiments of an optical detection apparatus are disclosed which may include one or more of a waveguide, a trench formed in the waveguide, a reflective surface, and a photodetector. The waveguide may be formed in a semiconductor substrate to propagate an optical signal received at a first end of the waveguide. The trench may also be formed in the waveguide having a first sidewall and a second sidewall, the first and second sidewalls forming first and second angles with the waveguide's propagation direction. The second sidewall may include a reflective surface formed thereon. The photodetector may be configured to receive an optical signal propagated in the waveguide, through the first sidewall and reflected from the reflective surface on the second sidewall.

Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit

Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.

Measuring the position of passively aligned optical components

An optical transmitter includes an external cavity laser array formed in a PLC, a trench-based detector array and an AWG. The external cavity laser is formed using an array of substantially similar laser gain blocks and an array of gratings formed in waveguides connected to the gain blocks. Each grating defines the output wavelength for its corresponding external cavity laser. Each detector of the detector array includes a coupler to cause a portion of a corresponding laser output signal of the laser array to propagate through a first sidewall of a trench and reflect off a second sidewall of the trench to a photodetector. In one embodiment, the photodetector outputs a signal indicative of the power level of the reflected signal, which a controller uses to control the laser array to equalize the power of the laser output signals.

A method is provided for electrically and mechanically connecting a first electronic device to a second electronic device. At least one electric contact of the first device is located against an electric terminal of the second device. The electric contact is tacked to the electric terminal by simultaneously applying heat and pressure between the electric contact and the electric terminal. The electric contact is subsequently diffusion-bonded to the electric terminal by applying heat to the electric contact and the electric terminal for a select period of time while a pressure between the electric contact and the electric terminal is reduced relative to the pressure when tacking the electric contact to the electric terminal.

Method of electrically and mechanically connecting electronic devices to one another

A method of making bondable contacts on a microelectronic element includes providing a microelectronic element having one or more die pads on a first face thereof and depositing conductive bonding material, such as gold, atop each die pad. The conductive bonding material is then shaped using a contact forming tool to form bondable contacts. The bondable contact has a substantially flat region and a second region projecting above the substantially flat region. The second region includes an apex adapted to abut against an opposing electrically conductive element. The bondable contacts may be formed one at a time or a plurality of the bondable contacts may be formed simultaneously. In one preferred embodiment, the projecting region of the contact defines a wedge-shaped projection that is bounded by the substantially flat region thereof. Each wedge-shaped projection may include an apex and side-walls extending between the apex and the substantially flat region of the contact.

Methods of making bondable contacts and a tool for making such contacts

A microelectronic component is made by providing a starting structure having a dielectric layer and leads on a surface of the dielectric layer. Ends of the leads are connected to contacts on a microelectronic element, such as the contacts on a semiconductor chip or wafer. The dielectric layer is then etched to partially detach the leads from the dielectric layer, leaving at least one end of each lead permanently connected to the dielectric layer. The remainder of the lead may be fully or partially detached from the dielectric layer. If the remainder of the lead is only partially detached, the connecting elements that connects the leads to the polymeric layer can be broken or peeled away from the leads during the step of moving the microelectronic element and dielectric layer away from one another. A microelectronic element assemble by includes a support structure having a dielectric layer and terminals disposed on the dielectric layer; a microelectronic element and a plurality of leads connecting contacts on the microelectronic element to terminals on the dielectric layer. The dielectric layer has a central region and a periphery region which surrounds the central region. The periphery region is disposed beneath the periphery of the microelectronic element.

Growing community of inventors

San Jose, CA, United States of America

Hamid Eslampour