Namlab Ggmbh

Globalfoundries U.S. Inc.

Globalfoundries Dresden Module One Limited Liability Company & Co. Kg.

Globalfoundries Dresden Module One Limited Liability Company & Kg

Halid Mulaosmanovic

Stefan Slesazeck

Stefan Dünkel

Sven Beyer

Dominik M Kleimaier

Bipul C Paul

Venkatesh P Gopinath

Pirooz Parvarandeh

Navneet Jain

Robert Binder

Zhixing Zhao

Johannes Müller

Evelyn Breyer

Joachim Metzger

An IC structure includes an MFMIS memory cell on a semiconductor substrate, and a CMOS transistor adjacent the MFMIS memory cell on the same semiconductor substrate. A method provides co-integration of the MFMIS memory cell with the CMOS transistor. The method may optionally co-integrate an MFIS memory cell. The IC structure and method provide a lower cost approach to forming MFMIS memory cells, which provide a number of advantages over MFIS memory cells.

IC structure with MFMIS memory cell and CMOS transistor

Structures including a ferroelectric field-effect transistor and methods of forming a structure including a ferroelectric field-effect transistor. The structure comprises a semiconductor substrate, a semiconductor layer, a dielectric layer arranged between the semiconductor layer and the semiconductor substrate, and first and second wells in the semiconductor substrate. The first well has a first conductivity type, and the second well has a second conductivity type opposite to the first conductivity type. A ferroelectric field-effect transistor comprises a gate structure on the semiconductor layer over the first well and the second well. The gate structure includes a ferroelectric layer comprising a ferroelectric material.

Ferroelectric field-effect transistors with a hybrid well

Structures for a static random access memory bit cell and methods of forming a structure for a static random access memory bit cell. The structure comprises a static random access memory bit cell including a first node and a second node, a first ferroelectric field-effect transistor including a first terminal connected to the first node, and a second ferroelectric field-effect transistor including a second terminal connected to the second node.

Non-volatile static random access memory bit cells with ferroelectric field-effect transistors

Structures for a ferroelectric field-effect transistor and methods of forming a structure for a ferroelectric field-effect transistor. The structure comprises a gate stack having a ferroelectric layer, a first conductor layer, and a second conductor layer positioned in a vertical direction between the first conductor layer and the ferroelectric layer. The first conductor layer comprises a first material, the second conductor layer comprises a second material different from the first material, and the second conductor layer is in direct contact with the ferroelectric layer.

Structures for a ferroelectric field-effect transistor and related methods

An artificial neuron integrated circuit including a polarizable circuit element having a first electrode, a second electrode, and a polarizable material layer disposed between the first and second electrodes, the polarizable material layer changeable between a first polarization state and a second polarization state, in response to receiving a number of voltage pulses across the first and second electrodes, the polarizable material layer to change from one of the first and second polarization states to the other of the first and second polarization states, where each of the number of voltage pulses individually is insufficient to change the polarization state.

Artificial neuron based on ferroelectric circuit element

A polarization-based logic gate includes a transistor having a drain and a polarizable material layer having at least two polarization states, the polarization state representing a first logic value, and a resistive element having a first terminal coupled to the drain and a second terminal. A plurality of input/output terminals connected to the transistor and second terminal of the resistive element so as to apply voltages to selected input/output terminals, including a sensing voltage representing a second logic value, with a resulting drain current of the transistor at least partially flowing through the resistive element and representing a result of a logic operation between the first logic value and the second logic value.

Polarization-based configurable logic gate

An integrated circuit includes a ferroelectric memory cell. The ferroelectric memory cell includes a ferroelectric layer stack comprising at least one ferroelectric material oxide layer. Each of the ferroelectric material oxide layers includes a ferroelectric material that is at least partially in a ferroelectric state. The ferroelectric layer stack comprises at least two ferroelectric domains. Further, the voltage which is to applied to the layer stack to induce polarization reversal differs for the individual domains such that polarization reversal of individual domains or of a portion of the totality of ferroelectric domains within the ferroelectric material of can be attained.

Growing community of inventors

Dresden, Germany

Halid Mulaosmanovic