Rockwell Collins, Inc.

Haley M Steffen

Ross Keith Wilcoxon

Nathan P Lower

David L Westergren

Pete Sahayda

Brian K Otis

A method for fabricating semiconductor die with die-attach preforms is disclosed. In embodiments, the method includes: applying an uncured die-attach paste material to a surface of a forming substrate to form one or more die-attach preforms, the surface of the forming substrate formed from a hydrophobic material; curing the one or more die-attach preforms; performing one or more planarization processes on the one or more die-attach preforms; coupling a first surface of a semiconductor die to a handling tool; and bonding a second surface of the semiconductor die to at least one die-attach preform of the one or more die-attach preforms.

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Cedar Rapids, IA, United States of America

Haley M Steffen