Motorola Corporation

Hal R Canter

Anthony J Suppelsa

Henry F Liebman

James L Stephens

Anbuselvan Kuppusamy

Zalman Schwartzman

Michael S Beard

Justin R Wodrich

Kathleen Farrell, Legal Representative

An apparatus () is provided for dispersing heat from an integrated circuit () to a heat sink (). The apparatus () is formed on a nonconductive body () having at least two conductive surfaces () disposed thereon. One of the conductive surfaces () is reflowed to a heat generating lead of the integrated circuit (), and the other conductive surface () provides a surface for contacting a heat sink (). The apparatus () and integrated circuit provide a package () which can be tape and reeled () for easy mounting to a printed circuit board () of a communication device ().

Method and apparatus for dissipating heat from an integrated circuit

An evaporative cooling vessel (100) for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The evaporative cooling vessel (100) includes a cavity (105) for holding a fugitive material (107) at the housing (111) of an electronic part to maintain the housing at or below a specified temperature. As heat is applied during solder reflow, the electronic part is subjected to a high temperature capable of allowing solder to melt. Thus, the part housing (111) of the electronic part can be controlled at a substantially lower temperature than the reflow temperature. This allows the evaporative cooling vessel (110) to use the evaporative cooling properties of the fugitive material to prevent damage to the electronic part.

Evaporative cooling vessel for controlling the temperature of a portion

A method for controlling the temperature of a predetermined portion of an electronic part during the solder reflow process. The method includes the steps of applying (107) an absorbent material containing a fugitive material (109) to a predetermined portion of an electronic part which must be kept below the solder reflow temperature to prevent damage. Heat is then applied and the electronic part is subjected to a high reflow temperature capable of allowing solder to melt. The predetermined portion of the electronic part is controlled (113) at a substantially lower temperature than the high temperature due to evaporative cooling properties of the fugitive material avoiding damage to the electronic part.

Method of controlling the temperature of a portion of an electronic part

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Fort Lauderdale, FL, United States of America

Hal R Canter