United Microelectronics Corp.

Hal Lee

Chia-Wen Liang

Sun-Chieh Chien

Kun-Chi Lin

Der-Yuan Wu

Wei-Wu Liao

Chia-Hung Kao

Jason Jyh-Shyang Jenq

Jhy-Jeng Liu

A self-aligned process for forming a silicide layer over word lines in DRAM and a silicide layer over transistors in a logic device region. A substrate that includes a memory cell region and a logic circuit region is provided. A first transistor and a second transistor are formed over the substrate. The first transistor is formed in the logic circuit region and includes a first gate conductive layer and a first source/drain region. The second transistor is formed in the memory cell region and includes a second gate conductive layer and a second source/drain region. A blocking layer is formed over both the first transistor and the second transistor. A portion of the blocking layer is removed to expose the first gate conductive layer, the first source/drain region and the second gate conductive layer. The remaining blocking layer still covers the second source/drain region. A metal silicide layer is formed over the first gate conductive layer, the first source/drain region and the second gate conductive layer.

Self-aligned silicide process for forming silicide layer over word lines in DRAM and transistors in logic circuit region

A method for forming an integrated circuit device that incorporate both an array of memory cells and an array of logic circuits on a single chip or substrate is disclosed. The substrate has a transfer field effect transistor (FET) with a first gate electrode and a first source/drain region formed in and on a embedded DRAM region of the substrate and has a logic FET with a second gate electrode and a second source/drain region formed in and on a logic circuit region of the substrate. Next, a dielectric layer was deposited over the exposing surface of said transfer FET and above of the logic FET. Moreover, the dielectric layer was polished until upper surface of the first gate electrode and the second gate electrode is exposed. Subsequently, a photoresist layer is formed over the dielectric layer and the first gate electrode. And then the dielectric layer was etched until upper surface of the logic FET is exposed. Next, the photoresist layer was removed. Finally, a self-aligned silicide layer was deposited simultaneously over the exposed second gate electrode, over the second source/drain region and over the exposed first gate electrode.

Method for forming an embedded memory and a logic circuit on a single substrate

A method of fabricating a self-aligned capacitor of a DRAM cell is provided. First, a landing pad and a bit line are formed on a semiconductor substrate. An insulating layer is formed on the landing pad and the bit line. A photoresist layer is formed on the insulating layer and the pattern of the photoresist layer is transferred to the insulating layer. A via hole is formed in the insulating layer using the photoresist layer as a mask to expose the landing pad. Spacers are formed on the sidewalls of the via hole by deposition and self-align etching back. A conductive layer is formed in the via hole. The conductive layer on the insulating layer is removed to form a bottom electrode of a capacitor.

Method of fabricating self-aligned capacitor

A method for simultaneously forming a bit-line contact and a node contact first forms a polysilicon layer and a first insulator on a substrate, and then patterns patterning the polysilicon layer and the first insulator, wherein the substrate consists of an active area and an isolation area. Next, a second insulator is formed on the exposed substrate and the first insulator. Then, by forming a photoresist layer on the second insulator and patterning the photoresist layer, a pattern containing a bit-line contact pattern and a node contact pattern is transferred onto the second insulator. By performing an etching back process on the second insulator, the bit-line contact and the node contact are formed simultaneously in a self-aligned way.

Method for simutaneously forming bit-line contacts and node contacts

The present invention provides a fabricating method and structure of a dynamic random access memory. In this method, a substrate having a transistor thereon is provided. A bit line is formed on the substrate. The bit line is electrically coupled with the transistor through a contact hole. A second dielectric layer having a node contact opening is formed on the bit line. An etching step is performed to etch the bit line. A concave surface is formed on the sidewall of the bit line. Spacer layers are formed on the sidewalls of the node contact opening. Each spacer layer is used to insulate the concave surface. Thus, from the top-view layout, a portion of the node contact opening can overlap with the bit line. Thus, the size of DRAM is effectively reduced.

Fabricating method of a dynamic random access memory

A method for increasing landing pad area is disclosed. Firstly, providing a fundamental structure, wherein shallow trench isolation (STI) is used and acting as an electrical isolation inside of substrate. Moreover, there are at least two gates with an isolation layer on top of the substrate and covered with a dielectric layer. Between the neighboring gates there is a contact hole that penetrates the dielectric layer from the top of the dielectric layer to the substrate. Taking this fundamental structure as the starting point for forming a conductor within the contact hole. Etching back the dielectric layer and exposing its top surface and a portion of sidewalls. Finally, a protection layer on top of the exposed portion of sidewalls of the conductor is formed in order to expand the landing pad area. After all, one would still be able to increase the landing pad area even though the distance between two gates is rather small. This method can solve all the puzzles caused by alignment accuray shift during post-process.

Method for increasing landing pad area

A method of fabricating a capacitor includes formation of a first dielectric layer having a contact hole on a substrate. A conductive layer is formed over the substrate and is electrically coupled with a source/drain region through the contact hole. An isolation layer is formed on the conductive layer. The isolation layer and the conductive layer are patterned to form a patterned isolation layer and a raised region over the contact hole. A first spacer is formed on the sidewall of the patterned isolation layer and the raised region. The patterned isolation layer is removed. The first spacer is used as a mask to etch the conductive layer to form another two sidewalls. The first spacer is removed. Two spacers are formed on the two sidewalls and used as masks. The conductive layer is patterned again to form two raised regions concentrically in shape.

Method of fabricating a dynamic random access memory capacitor

A method for manufacturing DRAM capacitor comprising the steps of providing a substrate having a transistor already formed thereon and an insulating layer covered on top, wherein the insulating layer has an opening exposing one source/drain region of the transistor. Next, a first conductive layer, a first hemispherical grained silicon layer and a material layer are sequentially formed over the insulating layer and the source/drain region exposed through the contact opening, and then followed by a patterning operation. After that, a second conductive layer, a second hemispherical grained silicon layer are sequentially formed over the device, and then etched to expose the insulating layer and the material layer. Subsequently, the material layer is removed to expose the first hemispherical grained silicon layer forming a lower electrode. Finally, a dielectric layer and an upper electrode are sequentially formed over the lower electrode. The characteristic of this invention includes an effective increase in the surface area of the capacitor, the lowering of profile height of the capacitor, and the prevention of spike formation and its associated problems.

Method for manufacturing DRAM capacitor using hemispherical grained

A semiconductor fabrication method is provided for fabricating a capacitor electrode structure in an integrated circuit such as a DRAM (dynamic random-access memory) device to serve as a data storage capacitor for the DRAM device. According to this method, a self-aligned process is used to form the bottom electrode of each data storage capacitor of the DRAM device. The first step is to form a first insulating layer over the substrate, which is then selectively removed to form contact windows. Next, a plurality of polysilicon plugs are formed in these contact windows, with the top surfaces thereof being below the top surface of the first insulating layer by a predefined depth. After this, sidewall spacers are formed on the sidewalls of the remaining void portions of the contact windows. After bit lines are formed, another insulating layer is deposited and then selectively removed to form electrode-pattern openings to expose the polysilicon plug that is to be connected to the bottom electrode of the capacitor. Sidewall spacers are then formed on the sidewalls of the electrode-pattern openings. Finally, a conductive layer is formed over the sidewall spacers in each electrode-pattern opening to serve as the bottom electrode of the capacitor.

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Taipei, Taiwan

Hal Lee