Hughes Aircraft Company

Hal D Smith

Robert F McClanahan

Andrew A Shapiro

George P Pelzman

Ronald T Smith

Robert D Washburn

Joseph M Jacobs

Raymond L Brown

Dennis F Elwell

A technique for fixedly positioning a holographic recording laminate relative to a master hologram including the steps of inducing a electrostatic charge on the holographic recording laminate and positioning the recording laminate in close proximity to the master hologram such that the electrostatic charge on the recording laminate causes a static attraction between the recording laminate and the master hologram that retains the recording laminate in a fixed position relative to the master hologram.

Holographic replication of copy film to hologram master

Ferrimagnetic structures formed of ferrimagnetic vias in a unitized multilayer microcircuit structure that is formed of a plurality of co-fired insulating layers.

Ferrimagnetic vias within multi-layer 3-dimensional structures/substrates

An elongated composite tape structure including an elongated carrier, and a plurality of sinterable, thermally fusible tape strips of different characteristics disposed on the elongated carrier. Also disclosed is a reel-to-reel process wherein the composite tape structure as stored on a reel is incrementally processed by longitudinally feeding the tape structure through one or more processing stations at each of which the tape is driven in an indexed manner so that predetermined portions of the tape are processed at each station for substantially the length of the tape structure.

HTCC/LTCC use of multiple ceramic tapes in high rate production

Apparatus for blanking and collating a plurality of individual pyrolyzable sheets having electrical circuit patterns formed thereon from an integral pyrolyzable sheet having the electrical circuit patterns for the individual sheets printed thereon, where the individual pyrolyzable sheets comprise layers of a hybrid module. The apparatus includes a die having substantially identically sized openings for supporting the integral printed pyrolyzable sheet, a punch assembly engageable with the die for blanking the integral printed pyrolyzable sheet into a plurality of substantially identically sized sheets having electrical circuit patterns formed thereon, and a collation structure located beneath the means for receiving the blanked sheets from the die and for stacking the blanked sheets.

HTCC/LTCC substrate blanker/multi-layer collation die

Die punch apparatus including an electromagnetic die head core having a plurality of punch die retaining apertures, a plurality of magnetically attractable die punch assemblies respectively retained in the plurality of die retaining apertures, and a receiver plate core having punch receiver assemblies for receiving the punch pins of the punch die assemblies.

Magnetic punch die retention for HTCC/LTCC fabrication

Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contacting predetermined tops and bottoms of the resistive via fills, and conductive via fills for providing external electrical connection to selected ones of the conductive elements at locations on the outside the unitized multilayer circuit structure. A further via resistor structure includes a resistive via fill formed in a via in one of the insulating layers, and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure. Another via resistor structure comprises ratioed via resistors comprising a plurality of resistive via fills formed in respective vias in one of the insulating layers, said vias having substantially the same thickness and having respective cross-sectional areas selected to provide resistance values having predetermined ratios.

Via resistors within-multi-layer, 3 dimensional structures substrates

A capacitor structure in a hybrid multilayer circuit having a plurality of insulating layers, the capacitor structure including a dielectric via fill in a via formed in one of the insulating layers, a first conductive element overlying the dielectric via fill, and a second conductive element underlying said dielectric via fill. Each of the first and conductive elements comprises a conductive via fill or a conductive trace.

Growing community of inventors

Rancho Palos Verdes, CA, United States of America

Hal D Smith