Samsung Electronics Co., Ltd.

Hakyoung Kim

Dougyong Sung

Jongwoo Sun

Kyeongtea Bang

Chulwoo Park

Wookwang Lee

Keonwoo Kim

Kyoungwon Kim

Dowon Kim

Yun-Kwang Jeon

Yonghee Kim

Minyoung Hur

Seungwon Shin

Byeongsang Kim

Youngjin Noh

Dongyun Yeo

Eungsu Kim

Hyanjung Lee

Heewon Min

Kyeongseok Jeong

Wonyoung Jee

Jisoo Im

Taekjoon Rhee

Sungwook Hong

Sangmin Jeong

Disclosed are plasma baffles, substrate processing apparatuses, and substrate processing methods. The plasma baffle comprises a lower ring, an upper ring outside the lower ring in a plan view and extending vertically, and an intermediate ring that extends from the lower ring to the upper ring to form an acute angle with respect to a horizontal direction. The lower ring includes a lower central hole that vertically penetrates a center of the lower ring, and a plurality of lower slits outside the lower central hole and vertically penetrating the lower ring. The intermediate ring provides an intermediate slit that connects an inner lateral surface of the intermediate ring to an outer lateral surface of the intermediate ring. An area ratio of the plurality of lower slits to the lower ring is equal to or greater than about 59%.

Plasma baffle, substrate processing apparatus including the same, and substrate processing method using the same

An electronic device is provided. The electronic device includes a connector including one or more signal terminals and a control circuit electrically connected with the one or more signal terminals. The control circuit may be configured to monitor attachment with an external device through an identification terminal among the one or more signal terminals, identify whether a designated number of, or more, monitoring signals related to attachment with the external device are detected during a designated time, and identify whether there is the attachment with the external device, based on a voltage of a power terminal among the one or more signal terminals, in response to the detection of the monitoring signals being identified.

Method for preventing malfunction of connector and electronic device having connector

A method of manufacturing a semiconductor device includes: providing a first process gas including oxygen and a second process gas including carbon and fluorine to a process chamber at a first flow rate ratio to etch an etch target layer; and providing the first process gas and the second process gas to the process chamber at a second flow rate ratio to passivate the etch target layer, wherein a flow rate of the first process gas is substantially constant.

Method of manufacturing semiconductor device

A plasma processing apparatus includes a chamber; a support member in the chamber; a window plate at an upper portion of the chamber and including a window plate body and a fastening hole, wherein the fastening hole includes a lower fastening hole portion and an upper fastening hole portion. and a gas injector including a first body having a plurality of distribution nozzles and a second body having an accommodating groove to which the first body is fastened and a plurality of injection nozzles. The second body includes a first portion disposed inside the upper fastening hole portion, a second portion disposed inside the lower fastening hole portion, and a third portion disposed below the window plate. The second portion of the second body includes a gas hole extending from the accommodating groove to an external side surface of the second portion of the second body.

Plasma processing apparatus

An electrostatic chuck includes a chuck plate configured to mount a substrate, an insulation pillar provided outside the chuck plate, the insulation pillar having a pin hole formed therein, a first movable ring provided on the insulation pillar, surrounding a side of the chuck plate, a second movable ring configured to cover at least a part of an upper portion of the first movable ring, and a driving pin configured to move in the pin hole of the insulation pillar in a vertical direction, the driving pin overlapped by at least a part of the first movable ring and at least a part of the second movable ring in the vertical direction. The driving pin is configured to drive the first movable ring and the second movable ring in the vertical direction or to drive the second movable ring in the vertical direction.

Electrostatic chuck and substrate processing apparatus including the same

Disclosed are a substrate inspection apparatus and a substrate processing system. The substrate inspection apparatus includes a sensor module and a jig associated with the sensor module to transfer the sensor module. The sensor module may include a housing having a first surface and a second surface facing each other and including an insertion hole connecting the first and second surfaces to each other, a sensor inserted into the insertion hole to measure a state of the substrate, and a tilting member on the housing to adjust tilt of the housing.

Substrate inspection apparatus and substrate processing system including the same

A cover plate, a plasma treatment system, and a plasma treatment method therewith are disclosed. The plasma treatment system may include a window, an antenna electrode disposed on the window, and a cover plate disposed between the antenna electrode and the window to cover top and side surfaces of the window.

Plasma treatment system including cover plate to insulate window

Growing community of inventors

Bucheon-si, South Korea

Hakyoung Kim