Asml Netherlands B.v.

Hakki Ergun Cekli

Richard Johannes Franciscus Van Haren

Reiner Maria Jungblut

Xing Lan Liu

Leon Paul Van Dijk

Stefan Cornelis Theodorus Van Der Sanden

Irina Lyulina

Manfred Gawein Tenner

Masashi Ishibashi

Ronald Henricus Johannes Otten

Cedric Marc Affentauschegg

A lithographic process includes clamping a substrate onto a substrate support, measuring positions across the clamped substrate, and applying a pattern to the clamped substrate using the positions measured. A correction is applied to the positioning of the applied pattern in localized regions of the substrate, based on recognition of a warp-induced characteristic in the positions measured across the substrate. The correction may be generated by inferring one or more shape characteristics of the warped substrate using the measured positions and other information. Based on the one or more inferred shape characteristics, a clamping model is applied to simulate deformation of the warped substrate in response to clamping. A correction is calculated based on the simulated deformation.

Lithographic apparatus, device manufacturing method and associated data processing apparatus and computer program product

A deformation pattern recognition method including providing one or more deformation patterns, each deformation pattern being associated with a deformation of a substrate that may be caused by a processing device; transferring a first pattern to a substrate, the first pattern including at least N alignment marks, wherein each alignment mark is positioned at a respective predefined nominal position; processing the substrate; measuring a position of N alignment marks and determining an alignment mark displacement for the N alignment marks by comparing the respective nominal position with the respective measured position; fitting at least one deformation pattern to the measured alignment mark displacements; determining an accuracy value for each fitted deformation pattern, the accuracy value being representative of the accuracy of the corresponding fit; using the determined accuracy value, determining whether an associated deformation pattern is present.

Deformation pattern recognition method, pattern transferring method, processing device monitoring method, and lithographic apparatus

Growing community of inventors

Singapore, Singapore

Hakki Ergun Cekli