Applied Materials, Inc.

Hakeem M Oluseyi

Padmapani Nallan

Moshe Sarfaty

Meihua Shen

Nicolas Gani

Yan Du

Oranna Yauw

A method, system, and medium of spectroscopically modeling and/or controlling a semiconductor manufacturing process. The modeling/controlling includes the steps of conducting a plurality of semiconductor manufacturing process runs by changing at least one of process parameters from its target value, and collecting spectral data indicative of the light emitted by plasma during each of said semiconductor manufacturing process runs. The modeling/controlling also includes the step of formulating a ratio based on a relationship between the collected spectral data and the changes in the at least one of the plurality of process parameters.

System, method and medium for modeling, monitoring and/or controlling plasma based semiconductor manufacturing processes

Methods for etching electrodes formed directly on gate dielectrics are provided. In one aspect, an etch process is provided which includes a main etch step, a soft landing step, and an over etch step. In another aspect, a method is described which includes performing a main etch having good etch rate uniformity and good profile uniformity, performing a soft landing step in which a metal/metal barrier interface can be determined, and performing an over etch step to selectively remove the metal barrier without negatively affecting the dielectric. In another aspect, a method is provided which includes a first non-selective etch chemistry for bulk removal of electrode material, a second intermediate selective etch chemistry with end point capability, and then a selective etch chemistry to stop on the gate dielectric.

High selectivity and residue free process for metal on thin dielectric gate etch application

A method and system to monitor characteristics of films by sensing the spectral emissions of a plasma to which the films are exposed. As a result, the method includes sensing optical energy produced by the plasma. The optical energy has a plurality of spectral bands associated therewith, a subset of which is identified as including information corresponding to the film characteristics. The film characteristics are then measured as a function of this information. To increase the accuracy of the measurements, in one embodiment of the present invention a subgroup of the plurality of spectral bands is observed that has data associated that is substantially independent of the characteristics of interest. The characteristics are then measured as a function of both the information and the data.

Monitoring of film characteristics during plasma-based semi-conductor processing using optical emission spectroscopy

A method and an apparatus system feature detecting faults in process conditions of a plasma-based semiconductor processing system by sensing the spectral emissions of the plasma. As a result, the method includes sensing optical energy produced by the plasma and identifying the fault in the process conditions as a function of one or more of the plurality of spectral bands. To that end, the apparatus includes a detector in optical communication with the processing chamber to sense optical energy generated by the plasma, and a spectrum analyzer, in electrical communication with the optical detector. The spectrum analyzer resolves the spectral bands and produces information corresponding thereto. A processor is in electrical communication with the spectrum analyzer, and a memory is in electrical communication with the processor. The memory includes a computer-readable medium having a computer-readable program embodied therein that controls the system to carry-out the method.

Method and apparatus employing optical emission spectroscopy to detect a fault in process conditions of a semiconductor processing system

The present invention relates to a method of etching tungsten or tungsten nitride in semiconductor structures. We have discovered a method of etching tungsten or tungsten nitride which permits precise etch profile control while providing a rapid etch rate. In particular, the method employs the use of a plasma source gas where the chemically functional etchant species are generated from a combination of sulfur hexafluoride (SF ) and nitrogen (N ), where the sulfur hexafluoride and nitrogen are provided in a volumetric flow rate ratio within the range of about 1:2.5 to about 6:1.

Method of etching tungsten or tungsten nitride in semiconductor structures

The present invention relates to a method of etching tungsten or tungsten nitride in semiconductor structures, and particularly to the etching of gate electrodes which require precise control over the etching process. We have discovered a method of etching tungsten or tungsten nitride which permits precise etch profile control while providing excellent selectivity, of at least 175:1, for example, in favor of etching tungsten or tungsten nitride rather than an adjacent oxide layer. Typically, the oxide is selected from silicon oxide, silicon oxynitride, tantalum pentoxide, zirconium oxide, and combinations thereof. The method appears to be applicable to tungsten or tungsten nitride, whether deposited by physical vapor deposition (PVD) or chemical vapor deposition (CVD). In particular, an initial etch chemistry, used during the majority of the tungsten or tungsten nitride etching process (the main etch), employs the use of a plasma source gas where the chemically functional etchant species are generated from a combination of sulfur hexafluoride (SF ) and nitrogen (N ), or in the alternative, from a combination of nitrogen trifluoride (NF ), chlorine (Cl ), and carbon tetrafluoride (CF ). Toward the end of the main etching process, a second chemistry is used in which the chemically functional etchant species are generated from Cl and O . This final portion of the etch process may be referred to as an &ldquo;overetch&rdquo; process, since etching is carried out to at least the surface underlying the tungsten or tungsten nitride. However, this second etch chemistry may optionally be divided into two steps, where the plasma source gas oxygen content and plasma source power are increased in the second step.

Method of etching tungsten or tungsten nitride electrode gates in semiconductor structures

The present invention relates to a method of etching tungsten or tungsten nitride in semiconductor structures, and particularly to the etching of gate electrodes which require precise control over the etching process. We have discovered a method of etching tungsten or tungsten nitride which permits precise etch profile control while providing excellent selectivity, of at least 175:1, for example, in favor of etching tungsten or tungsten nitride rather than an adjacent oxide layer. Typically the oxide is selected from silicon oxide, silicon oxynitride, tantalum oxide, zirconium oxide, and combinations thereof. The method appears to be applicable to tungsten or tungsten nitride, whether deposited by physical vapor deposition (PVD) of chemical vapor deposition (CVD). In particular, an initial etch chemistry, used during the majority of the tungsten or tungsten nitride etching process (the main etch), employs the use of a plasma source gas where the chemically functional etchant species are generated from a combination of sulfur hexafluoride (SF ) and nitrogen (N ), or in the alternative, from a combination of nitrogen trifluoride (NF ), chlorine (Cl ) and carbon tetrafluoride (CF ). Toward the end of the main etching process, a second chemistry is used in which the chemically functional etchant species are generated from Cl and O . This final portion of the etch process may be referred to as an &ldquo;overetch&rdquo; process, since etching is carried out to at least the surface underlying the tungsten or tungsten nitride. However, this second etch chemistry may optionally be divided into two steps, where the plasma source gas oxygen content and plasma source power are increased in the second step.

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Los Gatos, CA, United States of America

Hakeem M Oluseyi