Intel Corporation

Hakan Erturk

Ioan Sauciuc

Gregory Martin Chrysler

George K Chen

Zhihua Li

Cheng-Chieh Hsieh

Xuejiao Hu

Edgar J Unrein

Jack Hu

The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.

Microfins for cooling an ultramobile device

In some embodiments, piezoelectric air jet augmented cooling for electronic devices is presented. In this regard, an apparatus is introduced having a plurality of more than about one hundred lead-free piezoelectric layers and electrodes stacked on top of each other and formed around a central opening, and a diaphragm coupled to the piezoelectric layers and substantially covering the central opening to vibrate and blow air when an operating voltage is applied to the electrodes. Other embodiments are also disclosed and claimed.

Piezoelectric air jet augmented cooling for electronic devices

A method, apparatus, and system related to thermal management. The method includes reducing a temperature of a stream of air upstream of at least one memory module by a heat absorption component of a refrigeration device, moving the stream of air into contact with at least one surface of the at least one memory module and transferring heat provided by the at least one memory module and a heat rejection component of the refrigeration device to a location downstream of the at least one memory module.

Method and system to cool memory

A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.

Heat dissipating device with enhanced boiling/condensation structure

A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in contact with the integrated circuit. Cooling liquid passes through the cold plate where it starts boiling inside of the microchannels. The wall allows gas bubbles to pass through while preventing the passage of liquid. As a result, the gas bubbles may be removed from the liquid flow by upward buoyancy. The removal of the gas bubbles improves the operation of the cold plate in some embodiments.

Cooling integrated circuits using a cold plate with two phase thin film evaporation

Some embodiments of a method and apparatus for cooling integrated circuit devices are described. In one embodiment, the apparatus includes a thermosiphon having an evaporator portion coupled to a first surface of a heat source and a condenser portion coupled to the evaporator portion distal from the first surface of the heat source. A remote heat exchanger is coupled to the condenser of the thermosiphon. In addition, one or more thermoelectric elements are coupled between the heat exchanger and the condenser of the thermosiphon. In one embodiment, the remote heat exchanger, the thermoelectric elements and the condenser portion of the thermosiphon are located outside a chassis of a one rack unit (1U) server computer.

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Phoenix, AZ, United States of America

Hakan Erturk