Asm IP Holding B.v.

Korea Institute of Science and Technology

Hak Joo Lee

Dae Youn Kim

Young Joon Baik

Wook Seong Lee

Yoon Ki Min

Jong Hyun Ahn

Jong Keuk Park

Jeong Jun Woo

Seung Woo Choi

Yong Min Yoo

Young Hoon Kim

Hyung Wook Noh

Seung Wook Kim

Jin Seok Park

Jae Hyun Kim

Gas supply plate for semiconductor manufacturing apparatus

Provided is a method of forming a thin film having a target thickness T on a substrate by an atomic layer deposition (ALD) method. The method includes n processing conditions each having a film growth rate that is different from the others, and determining ato athat are cycles of a first processing condition to an n-th processing condition so that a value of |T&#x2212;(a&#xd7;G+a&#xd7;G+ . . . +a&#xd7;G)| is less than a minimum value among G, G, . . . , and G, where n is 2 or greater integer, G, . . . , and Grespectively denote a first film growth rate that is a film growth rate of the first processing condition, . . . and an n-th film growth rate that is a film growth rate of the n-th processing condition, and the film growth rate denotes a thickness of a film formed per a unit cycle in each of the processing conditions. The film forming method may precisely and uniformly control a thickness of the thin film when an ALD is performed.

Method of forming thin film

An exhaust apparatus using a gas curtain instead of a mechanical opening/closing structure is provided. The exhaust apparatus includes: a first region; a second region connected to the first region; a third region connected to the first region; and a first gas line connected to the second region, wherein when gas is supplied to the first gas line, the first region does not communicate with the second region but communicates with the third region.

Exhaust apparatus and substrate processing apparatus having an exhaust line with a first ring having at least one hole on a lateral side thereof placed in the exhaust line

2-dimensional nanostructured tungsten carbide which is obtained by control of the alignment of nanostructure during growth of tungsten carbide through control of the degree of supersaturation and a method for fabricating same are disclosed. The method for fabricating 2-dimensional nanostructured tungsten carbide employs a chemical vapor deposition process wherein a hydrogen plasma is applied to prepare 2-dimensional nanostructured tungsten carbide vertically aligned on a nanocrystalline diamond film. The chemical vapor deposition process wherein the hydrogen plasma is applied includes: disposing a substrate with the nanocrystalline diamond film formed thereon on an anode in a chamber, disposing a surface-carburized tungsten cathode above and at a distance from the substrate, and applying the hydrogen plasma into the chamber.

Method for fabricating two dimensional nanostructured tungsten carbide

Methods for fabricating uniform nanocrystalline diamond thin films with minimized voids are presented. These uniform nanocrystalline diamond thin films can be formed on any number of treated silicon oxide surfaces such as on hydrogen plasma treated surfaces of silicon oxide-coated substrates or on hydrocarbon plasma pre-treated surfaces of silicon oxide-coated substrates. It is believed that treating these surfaces results in maximizing electrostatic attraction between these treated surfaces with nanodiamond particles during a subsequent ultrasonic seeding of the nanodiamond particles onto these threated surfaces. This can result in the nanodiamond particles being substantially uniformly distributed and bound on the treated silicon oxide surface.

Methods for fabricating nanocrystalline diamond film

Growing community of inventors

Incheon, South Korea

Hak Joo Lee