Kolon Industries, Inc.

Hak Gee Jung

Jae Il Kim

Dong Hee Lee

Hyo Jun Park

Chul Ha Ju

Jeong Han Kim

Young Sik Jeong

Ki Il Hong

Pradip Kumar Tapaswi

Ji Sung Kim

Sang Kyun Kim

Chang Sik Ha

Chung Seock Kang

Sang Hyun Ahn

Sang Min Song

Byung Joon An

Hang Geun Kim

Jong Won Yang

Woong Ki Min

Sang Wook Park

Doo Li Choi

Hak Yong Woo

Prdip Kumar Tapaswi

Ki Ll Hong

Chul Ha Joo

Ye Seul Kim

A polyimide-polybenzoxazole precursor solution, a polyimide-polybenzoxazole film, and a method of manufacturing the film are disclosed. A polyimide-polybenzoxazole film manufactured using the polyimide-polybenzoxazole precursor solution is formed by copolymerizing a unit structure of diamine and dianhydride and a unit structure of diaminophenol and dicarbonyl chloride in an organic solvent. The film is colorless and transparent, like conventional polyimide films, and can exhibit improved heat resistance and low birefringence.

Polyimide-polybenzoxazole precursor solution, polyimide-polybenzoxazole film, and preparation method therefor

The present invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and the diamine, and a third block, obtained by copolymerizing monomers including the aromatic dicarbonyl compound and aromatic diamine. The dianhydride for forming the first block includes 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine for forming the first block and the second block includes 9,9-bis(3-fluoro-4-aminophenyl)fluorene (FFDA).

Polyamide-imide precursor, polyamide-imide film, and display device comprising same

Disclosed is a polyimide cover substrate, which is configured such that a device protection layer is formed of a urethane acrylate compound on at least one side of a polyimide film, thereby exhibiting not only high flexural properties and impact resistance but also superior solvent resistance, optical properties and scratch resistance and low water vapor transmission rate, and thus can be effectively utilized as a cover substrate for a flexible electronic device.

Polyimide cover substrate

Disclosed is a plastic substrate, which includes a plastic film, a metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device.

Plastic substrate and device including the same

Disclosed are a transparent polyamide-imide resin and a film using the same, which can be colorless and transparent, can show excellent thermal stability and mechanical properties, and can have low birefringence, making it possible to serve in various fields including a semiconductor insulator, a TFT-LCD insulator, a passivation layer, a liquid crystal alignment layer, materials for optical communication, a protective film for a solar cell, a flexible display substrate and the like.

Transparent polyamide-imide resin and film using same

This invention relates to a polyamide-imide precursor, a polyamide-imide obtained by imidizing the same, a polyamide-imide film, and an image display device including the film. The polyamide-imide precursor includes, in a molecular structure thereof, a first block, obtained by copolymerizing monomers including dianhydride and diamine, and a second block, obtained by copolymerizing monomers including an aromatic dicarbonyl compound and aromatic diamine. The dianhydride includes biphenyltetracarboxylic acid dianhydride (BPDA) and 2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), and the diamine includes bistrifluoromethylbenzidine (TFDB).

Polyamide-imide precursor, polyamide-imide film and display device comprising same

This invention relates to a highly heat-resistant polyamic acid solution and a polyimide film having improved thermal dimensional stability, wherein the polyamic acid solution includes a polymer of a diamine compound, containing 1 to 10 mol % of a carboxylic acid functional group-containing diamine compound based on the total amount of diamine, and a dianhydride compound, and the polyimide film includes polyimide, which is an imidized product of the polyamic acid solution and is configured such that main chains thereof are crosslinked through an amide bond (&#x2014;CONH&#x2014;).

High heat-resistant polyamic acid solution and polyimide film

Disclosed is a polyamide-imide precursor having a molecular structure in which a first polymer, derived from polymerization of a dianhydride and a diamine, and a second polymer, derived from polymerization of a diamine and an aromatic dicarbonyl compound, are copolymerized, wherein the diamine includes 3 to 50 mol % of at least one of 9,9-bis(4-aminophenyl)fluorene (FDA) and 9,9-bis(4-amino-3-fluorophenyl)fluorene (F-FDA), based on the total molar amount of the diamine. Also, a copolymerized polyamide-imide in which the polyamide-imide precursor is imidized or a copolymerized polyamide-imide film formed by an imidization reaction of the polyamide-imide precursor and an image display device including the copolymerized polyamide-imide film are provided.

Disclosed is a conductive layer including photopolymerizable resin having dispersed carbon nanotubes, which is transparent with high electrical conductivity and facilitates the formation of an electrode pattern. A laminate and a transparent electrode, including the conductive layer, are also provided.

Transparent electrode, conductive laminate and conductive layer

This invention relates to polyimide, which includes amorphous silica particles having OH groups thereon and is thus highly heat-resistant, colorless and transparent, and to a polyimide film manufactured using the polyimide.

Polyimide and polyimide film comprising the same

Disclosed is a plastic substrate, which includes a plastic film, a reflective and/or conductive metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device.

The present invention provides a plastic substrate, including: a polyimide film; a hard coating layer formed on one side of the polyimide film; and a transparent electrode layer formed on the other side of the polyimide film. The plastic substrate has excellent light transmittance high hardness characteristics, superior ITO processability and flexibility. Further, the plastic substrate can function as both a window film and an electrode film when it is applied to a touch screen panel. Thus, the present invention provides a touch screen panel which can be slimmed by reducing the number of laminated films including the plastic substrate.

Plastic substrate, method for producing the same and touch screen panel containing the same

The present invention relates to a novel acid dianhydride, a method for preparing the same, and a polyimide prepared therefrom. More specifically, the acid dianhydride according to the present invention is useful as a colorless transparent polyimide unit exhibiting excellent thermal stability and a low dielectric ratio, and the polyimide of the present invention has excellent solubility to an organic solvent compared with the conventional polyimide.

Acid dianhydride, method for preparing same, and polyimide prepared therefrom

This invention relates to a polyimide and a film using the same and, more particularly, to a polyimide, which can exhibit a low dielectric constant while retaining the superior properties thereof, and can thus be utilized as electronic materials such as protective materials or insulating materials for liquid crystal displays or semiconductors, and optical communication materials such as optical waveguide materials, and to a polyimide film including the same.

Growing community of inventors

Yongin-si, South Korea

Hak Gee Jung