Lenovo (singapore) Pte. Ltd.

Hajime Yoshizawa

Akinori Uchino

Shusaku Tomizawa

Takuroh Kamimura

Kazuhiro Kosugi

Atsunobu Nakamura

Hiroki Oda

Yuhsaku Sugai

Hao-Yu Wang

Masahiro Kitamura

Atsushi Ohyama

Yusaku Morishige

Takateru Adachi

Toyoaki Inada

Qianyi Lu

A vapor chamber includes: a first metal plate; a second metal plate having an outer edge portion joined to the first metal plate and forming a sealed space in which working fluid is enclosed, the sealed space being formed between the first metal plate and the second metal plate; and a wick stored inside the sealed space. The first metal plate has a through-hole communicating with the sealed space, and the vapor chamber further includes a metal block inserted into the through-hole and joined to the first metal plate to seal the through-hole, the metal block having an outer surface formed flat on a side opposite to a side facing the sealed space.

Vapor chamber and electronic apparatus

An electronic apparatus includes: a chassis; a heating element; a cooling module having a fan, a heat sink, and a heat transport device, the cooling module being configured to cool the heating element. The heat sink includes: a base plate; a plurality of fins standing from the base plate and placed with a gap between the fins to define an air channel through which air from the air outlet flows; and an inclined plate dividing the air channel in two stages in the standing direction of the fins and being gradually inclined from upstream to downstream of the air channel.

Electronic apparatus, cooling module, and heat sink

A cooling module includes: a fan having a fan housing with an intake port and an exhaust port; a fin that faces the exhaust port of the fan; a heat pipe connected to a surface of the fin; and a plate-shaped vapor chamber having a first surface and a second surface, the heat pipe being connected to the first surface while straddling one edge of the vapor chamber, the second surface at the one edge being connected to the surface of the fin to be parallel with the heat pipe, so that the one edge is disposed between the heat pipe and the fin.

Cooling module and electronic apparatus

Systems, apparatus, and methods that control power consumption in a processor are disclosed. One system apparatus, and method includes a processor that operates in at least a first power control mode including a first power amount and a second power control mode including a second power amount lower than the first power amount and a power control device. The power control device is configured to control power consumption in the processor, change a power control mode of the processor to the first power control mode in response to a first excess time period in which the power consumption of the processor exceeds a first reference power for a first period of time, and change the power control mode of the processor to the second power control mode in response to a second period of time in which the power consumption is less than or equal to a second reference power.

Systems, apparatus, and methods for controlling power consumption in an information handling device

An information processing apparatus that detects processing to be executed by a processor includes: a display that displays a status of the processing to be executed by the processor; and a switching controller that switches between a first adjustment mode and a second adjustment mode in association with predetermined processing to be executed without displaying the execution status on the display. The first adjustment mode sets, as a target for selection, a first selection range including a plurality of processing power classes classified according to the magnitude of the processing power. The second adjustment mode sets, as a target for selection, a second selection range in which a first processing power class related to relatively high processing power is excluded from among the first processing power class, a second processing power class, and a third processing power class of the first selection range.

Information processing apparatus and method

An apparatus for heat suppression in an initial setting mode includes, in one embodiment, an execution unit of an information processing device that executes an operation related to an initial setting mode of the information processing device, a power supply that supplies power to one or more heat generating components of the execution unit, and a controller that controls at least the power supplied by the power supply to make an amount of heat generation of the execution unit in the initial setting mode lower than the amount of heat generation of the execution unit in an operating mode after termination of the initial setting mode until fulfillment of a predetermined condition. A method and a computer program product also perform functions of the apparatus.

Heat suppression in an information processing device in an initial setting mode

An information processing device suppresses the entering of a state unintended by a user in a standby mode. The information processing device, which has a standby mode and a normal operation mode, has a mode control portion changing the mode to the standby mode of bringing the state into a first low power consumption state and configured to be switched to a first operating state in which background processing is executed in response to a stop of a display of a display portion, and a power setting processing portion configured to set a first upper limit power consumption in the first operating state and a second upper limit power consumption in a second operating state in the normal operation mode, and set the first upper limit power consumption so as to be lower than the second upper limit power consumption when the mode control portion changes the mode to the standby mode.

Information device with improved operating modes

An electronic apparatus which can achieve both a reduction in thickness of a chassis and an improvement in a heat releasing performance is provided. An electronic apparatusincludes a chassishaving an electronic componentarranged therein, a heat sinkwhich is provided in the chassisand absorbs heat generated from the electronic componentwhen its one surfaceis arranged to enable conduction of the heat from the electronic component, and a heat conducting sheetwhich is arranged in the chassis, closely arranged on the other surfaceon the side opposite to the one surfaceof the heat sink, has an outer shape area larger than an outer shape area of the heat sink, and extends to the outside of an outer shape of the heat sink

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Yokohama, Japan

Hajime Yoshizawa