Ibiden Company Limited

Hajime Yazu

Naohiro Hirose

Yoshiyuki Iwata

Masanori Kawade

Hitoshi Ito

Takao Iriyama

A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.

Conductive pin attached to package substrate

A package substrateincorporating a substrate provided with a conductor layer, a conductive connecting pinarranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a padfor securing the conductive connecting pin is provided for the package substrate. The padis covered with an organic resin insulating layerhaving an openingthrough which the padis partially exposed to the outside. The conductive connecting pinis secured to the pad exposed to the outside through the opening with a conductive adhesive agentso that solution of the conductive connecting pinfrom the substrate occurring, for example when mounting is performed is prevented.

Package substrate with a conductive connecting pin

A package substrateincorporating a substrate provided with a conductor layer, a conductive connecting pinarranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a padfor securing the conductive connecting pin is provided for the package substrate. The padis covered with an organic resin insulating layerhaving an openingthrough which the padis partially exposed to the outside. The conductive connecting pinis secured to the pad exposed to the outside through the opening with a conductive adhesive agentso that solution of the conductive connecting pinfrom the substrate occurring, for example when mounting is performed is prevented.

Conductive connecting pin for package substance

Conductive connecting pin and package substrate

Conductive connecting pins for a package substrate

An electronic component mounting board includes a substrate having an electronic component mounting opening formed in an upper surface thereof and a recess provided on a rear surface thereof larger in size than the electronic component mounting opening; a heat radiating plate fixed to the recess by bonding material with a position of an upper surface of that heat radiating plate exposed to the electronic component mounting opening; an exposed depression extending over the substrate and the heat radiating plate at a position where a side wall of the recess and a side wall of the heat radiating plate confront each other and having a part of the bonding material exposed flush with a bottom surface thereof; and a metal plating layer continuously covering in sequence a lower surface of the heat radiating plate, a surface of the exposed depression and a rear surface of the substrate. A method of manufacturing the aforesaid electronic component mounting board is also set forth.

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Ogaki, Japan

Hajime Yazu