The Yokohama Rubber Co., Ltd.

Hitachi Chemical Company, Ltd.

Hitachi, Condenser Co., Ltd.

Hajime Yamazaki

Misao Hiza

Hiroyuki Wakamatsu

Hideo Watanabe

Shigeo Omote

Toshinobu Takahashi

Kazuhiro Sugihara

Tetsu So

Shin Takanezawa

Naoki Fukutomi

Toshiro Okamura

Hiroshi Takahashi

Naoya Adachi

Hiroyoshi Yokoyama

Masao Kanno

Adhesive compositions of a selected class of epoxy resins combined with a selected class of carboxylic group-containing acrylonitrile-butadiene and methacrylonitrile-butadiene copolymers, maleimide derivatives and an imidazole compound. The resultant compositions are electrically insulative, thermally resistant, highly capable of fabrication at low pressure and storage stable.

Adhesive of epoxy resin, CTBN and maleimide

By using a composite film comprising an additive layer and an insulating layer containing an epoxy resin and a synthetic rubber as major components, printed wiring boards having a higher circuit density and higher reliability can be produced simply and effectively.

Process for producing printed wiring boards

Composite films for use in printed wiring boards are comprised of an insulating layer and a copper foil laminated thereover, the insulating layer being made up predominantly of a selected epoxy resin and a selected acrylonitrile-butadiene rubber, whereby voidlessness, thickness uniformity and insulation adjustment are enhanced. Also disclosed is a method of producing a printed wiring board using the film by a subtractive process.

Printed wiring board

A microwave absorptive composite suitable for use in ships, aircrafts and the like comprises an outermost layer of a thermosetting resin-impregnated, fibrous sheet; an intermediate layer of a normally liquid, carbonblack-containing silicone rubber sheet; and an innermost layer of a reinforced thermosetting resin sheet, the three layers being integrally laminated in that order. The silicone rubber is curable at room temperature or with heat.

Microwave-absorptive composite

A multi-layered microwave absorber suitable for use in ships, aircrafts and the like comprises a plurality of layers differing in impedance which are bonded together into an integral sheet structure by a silicone-type adhesive compound applied to a coat thickness of less than 0.1 mm. The absorber is capable of wave absorption over a wide band, free from deformation or distortion, and highly heat-resistant and weather-proof. A method of manufacturing the multi-layered microwave absorber is also disclosed.

Multi-layered microwave absorber and method of manufacturing the same

An adhesive composition comprising, by weight, (1) 100 parts of triglycidyl ether of trisphenol, (2) 0-40 parts of a polyfunctional epoxy resin, (3) a diamine type curing agent selected from (a) an aromatic diamine compound and (b) a reaction product having an amino group at each terminal thereof, prepared by reacting together an aromatic diamine compound, divinylsilane compound and bismaleimide compound, and, if desired, (4) a powdery inorganic filler.

Adhesive compositions

Epoxy resin composition

Growing community of inventors

Hadano, Japan

Hajime Yamazaki