Murata Manufacturing Co., Ltd.

Hajime Suemasa

Yasuo Yamada

Masayuki Atokawa

Takashi Maruyama

Hideyuki Kato

Hitoshi Tada

Haruo Matsumoto

Kikuo Tsunoda

Hirofumi Miyamoto

Hirohumi Miyamoto

Hiroshi Tada

Hiroki Wakamatsu

Shinichi Kenzaki

Nobuyoshi Honda

A probe for characteristic inspection of a connector includes a plunger, a coaxial cable, a flange, and a housing having an end portion on one side including an increased diameter portion. A recessed portion which receives the increased diameter portion is in an upper surface of the flange. The increased diameter portion has side walls in contact with or facing respective inner side surfaces of the flange partly, with the inner side surfaces forming the recessed portion, and a bottom wall in contact with an upper recessed surface of the flange that forms the recessed portion. The increased diameter portion has connection surfaces connecting the bottom and side walls and inclined inward from one of the side walls toward the bottom wall. Alternatively, the inner side surfaces each have a first surface inclined downward, and a vertical surface extending downward from the first surface to the upper recessed surface.

Probe for characteristic inspection of a connector

An outer conductor, an input terminal electrode, an output terminal electrode, a voltage controllable terminal electrode, and two separated electrodes are formed on the outer face of a dielectric block. Furthermore, on the upper face of the dielectric block, PIN diodes which are voltage controllable reactance elements, and inductors for voltage-controlling the PIN diodes, and a coupling adjustment capacitor are mounted. Frequency shifting capacitors are formed by generation of electrostatic capacitances between the separated electrodes and the inner conductors of the resonance holes, respectively.

Dielectric filter, antenna sharing device, and communication device having a voltage controlled reactance element for tuning the center frequency

An electronic part comprising: a printed circuit board including a first major surface and a second major surface; a circuit element disposed on the first major surface of the printed circuit board; a terminal electrode disposed on the second major surface of the printed circuit board and including a major surface opposed to the second major surface of the printed circuit board; a soldering-resistant film disposed on the second major surface of the printed circuit board and including a major surface opposed to the second major surface of the printed circuit board; wherein the distance between the major surface of the terminal electrode and the second major surface of the printed circuit board is substantially equal to or larger than the distance between the major surface of the soldering-resistant film in the vicinity of the terminal electrode and the second major surface of the printed circuit board.

Electronic part, dielectric filter, dielectric duplexer, and manufacturing method of the electronic part

A filter with which it is possible to control the relationship between a pass band and an attenuation band. In this filter, for example, a single-stage trap filter is electrically connected to a three-stage band pass filter via a coupling capacitor. The trap filter has a serial resonance section composed of a resonator and a resonance capacitor. The serial resonance section is connected in parallel to a capacitive reactance element (capacitor), and a serial circuit composed of an inductive reactance element (inductor) and a PIN diode as a switching element. The capacitive reactance element and the inductive reactance element both serve to make an admittance of the trap circuit substantially zero.

Filter, antenna duplexer, and communication apparatus incorporating the same

A frequency variable filter in which both the frequency of an attenuation pole and the attenuation bandwidth can be varied. In the frequency variable filter, two serial resonance sections composed of resonators and resonance capacitors are electrically connected to each other via a capacitor. The respective resonator in each of the serial resonance sections is electrically connected in parallel with a corresponding serial circuit composed of a frequency shifting capacitor and a PIN diode. A coupling capacitor electrically connects the junctions defined respectively between the frequency shifting capacitor and the PIN diode in each of the serial circuits.

Frequency variable filter, antenna duplexer, and communication apparatus incorporating the same

In an antenna-sharing device, a transmission filter is electrically connected between a transmission terminal and an antenna terminal, and a reception filter is electrically connected between a reception terminal and the antenna terminal. A signal pattern and a ground electrode are formed on a resonator-mounting surface of a circuit substrate. On the ground electrodes, the resonators constituting the transmission filter are integrally soldered and the resonators constituting the reception filter are integrally soldered. On the mounting surface of the circuit substrate, a transmission filter ground electrode and a reception filter ground electrode are formed. Both ground electrodes are isolated from each other by a gap (slit), and are disconnected from each other.

High frequency circuit device, antenna-sharing device, and communication apparatus having spaced apart ground electrodes

A method of manufacturing a dielectric resonant component includes at least one dielectric multistage resonator including one dielectric block, a plurality of inner conductor formation holes formed in the one dielectric block, an inner conductor formed on an inner surface of each of the inner conductor formation holes, and an outer conductor covering a substantially entire outer surface of the one dielectric block, the dielectric multistage resonator constituting a plurality of dielectric resonators in the one dielectric block; and a mount substrate fixedly mounted on the dielectric multistage resonator, for transmitting signal transmission between each of the dielectric resonators of the dielectric multistage resonator and an external circuit board, when the dielectric resonant component is mounted on the external circuit board. The dielectric multistage resonator further includes a pair of input/output electrodes, and the mount substrate includes a unit for connecting the input/output electrodes of the dielectric multistage resonator to a pair of input/output electrodes formed on the circuit board.

Method of manufacturing a dielectric resonant apparatus

A dielectric resonant component includes at least one dielectric multistage resonator including one dielectric block, a plurality of inner conductor formation holes formed in the one dielectric block, an inner conductor formed on an inner surface of each of the inner conductor formation holes, and an outer conductor covering a substantially entire outer surface of the one dielectric block, the dielectric multistage resonator constituting a plurality of dielectric resonators in the one dielectric block; and a mount substrate fixedly mounted on the dielectric multistage resonator, for transmitting a signal transmission between each of the dielectric resonators of the dielectric multistage resonator and an external circuit board, when the dielectric resonant component is mounted on the external circuit board. The dielectric multistage resonator further includes a pair of input/output electrodes, and the mount substrate includes a unit for connecting the input/output electrodes of the dielectric multistage resonator to a pair of input/output electrodes formed on the circuit board.

Dielectric resonant component with resist film on the mount substrate

A high-frequency electronic component includes: a base substrate and a high-frequency electronic component element which is mounted on one face of the base substrate by soldering. The base substrate is made of bismaleimide-triazine resin.

Growing community of inventors

Ishikawa-ken, Japan

Hajime Suemasa