Kyocera Corporation

Hajime Sasaki

Kazuki Hayata

The invention relates to a high-frequency circuit board that can efficiently radiate heat generated in a mounted electronic component without reducing the degree of freedom in design, a high-frequency circuit module including the high-frequency circuit board, and a radar apparatus including the high-frequency circuit module. A dielectric substrate () includes a mounting portion () that is disposed on one surface () of the dielectric substrate () and on which an electronic component () is to be mounted, and a waveguide () that is formed in the dielectric substrate (). The mounting portion () and the waveguide () are connected with each other through a heat conductor () having a thermal conductivity higher than that of the dielectric substrate ().

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Soraku-gun, Japan

Hajime Sasaki