Sharp Kabushiki Kaisha Corporation

Hajime Oda

Keiichi Sawai

Takayuki Taniguchi

Akio Shimoyama

Yasuhiro Koyama

Mutsuo Kawasaki

Osamu Miyake

Katsuji Kawakami

The present invention is a method for mounting, on a ceramic substrate (), an LED chip (), in which an upper surface of a positive electrode () is in a higher position than an upper surface of a negative electrode (). The method includes the steps of: (i) laminating resist () on the negative electrode () and the positive electrode () and forming openings (and) in the resist (); (ii) forming bumps (and) in the respective openings (and); (iii) removing the resist (); and (iv) bonding bumps (and) to the ceramic substrate (). A cross-sectional area of the opening () is larger than a cross-sectional area of the opening ().

Mounting method for semiconductor light emitter using resist with openings of different sizes

A method of manufacturing a semiconductor device can suppress the generation of burrs when an array of integrated circuits to which a supporting member is bonded for assistance is separated into chips. The supporting member having thinned regions (or void regions which are openings in the supporting member) located correspondingly beneath the scribing lines extending between the integrated circuits is bonded by an adhesive to the back side of a semiconductor substrate on which integrated circuits are arrayed at the primary side. Then, a dicing tape is attached to the support member to secure the entire assembly, and the assembly of the integrated circuits, the semiconductor substrate, the adhesive, and the supporting member are cut along the scribing lines, and then the dicing tape is removed.

Semiconductor device and manufacturing method thereof

Growing community of inventors

Osaka, Japan

Hajime Oda