Hitachi Cable, Inc.

Proterial, Ltd.

Hitachi Cable Fine-Tech, Ltd.

Hitachi Metals, Ltd.

Hajime Nishi

Hiroshi Okikawa

Hiroyuki Akutsu

Yuju Endo

Iku Higashidani

Takami Ushiwata

Yuki Honda

Hiromitsu Kuroda

Takayuki Tsuji

Hiroshi Bando

Ken Takahashi

Yukio Ito

Ikumi Ando

Katsunori Sawahata

Yoshiaki Nakamura

Seigi Aoyama

Hideki Yagyu

Yasuaki Yamamoto

Motoharu Kajiyama

Kentaro Segawa

Hiroo Kusano

Takeshi Usami

Masato Ito

Hiroshi Yamanobe

Takayuki Tanaka

Kuniaki Kimoto

An insulated wire includes a conductor having an elongated shape and an insulating coating. The insulating coating is provided around the conductor. The insulating coating is formed by laminating multiple insulating layers, each of which includes pores.

Insulated wire and method for manufacturing insulated wire

In an insulated wire including a conductor formed into a long shape and an insulation film formed by stacking at least one insulating layer covering a circumference of the conductor, the insulating layer includes a porous region and a resin region. The porous region is formed of a resin and multiple voids, and the resin region is formed of the resin. In the insulating layer, a boundary surface is not provided between a first boundary surface located on a radially inner side and a second boundary surface located on a radially outer side, and the porous region and the resin region are arranged in this order from the first boundary surface toward the second boundary surface.

Insulated wire

An insulated electrical wire is provided. The insulated electrical wire includes a conductor and an insulating film including pores. The insulating film at least includes a first insulating layer. The first insulating layer includes a first center region, a first inner side region, and a first outer side region. The first center region is a center region in the first insulating layer in a thickness direction and is formed of an insulating material and first pores that are the pores. The first pores are derived from a liquid thermally decomposable polymer. The first inner side region and the first outer side region are formed not to include the first pores.

Insulated electrical wire and method of manufacturing insulated electrical wire

A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material formed rectangular in a cross section thereof so as to be bonded by soldering to an electrode of a solar cell, using a flux. A thickness of an oxide film on a surface of the molten solder plated layer, which is a sum of a thickness of an SnO layer and a thickness of an SnOlayer on the surface of the molten solder plated layer, is not more than 7 nm.

Lead wire for solar cell, manufacturing method and storage method thereof, and solar cell

A halogen-free extra-high-voltage cable for railway rolling stock includes a stranded conductor, an inner semi-conducting layer covering the stranded conductor, an outer semi-conducting layer provided on an outer periphery of the inner semi-conducting layer via an insulation layer, and a sheath layer on an outer periphery of the outer semi-conducting layer, the sheath layer containing 80 to 200 parts by weight of metal hydroxide and 0.5 to 10 parts by weight of cross-linking agent with respect to 100 parts by weight of olefin-based polymer containing ethylene-vinyl acetate copolymer as a main component, the ethylene-vinyl acetate copolymer having a vinyl acetate content of not less than 40 wt % and less than 50 wt % and a melt flow rate of not more than 2.5 g/10 min and a resin composition is cross-linked.

Halogen-free extra-high-voltage cable for railway rolling stock

A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120&#xb0; C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.

Solar cell lead, method of manufacturing the same, and solar cell using the same

A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.

Solar cell lead wire and production method therefor and solar cell using same

A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of its surface, and the Sn-based material part includes a base metal doped with an oxidation control element. The oxidation control element is at least one element selected from a group consisted of P, Ge, K, Zn, Cr, Mn, Na, V, Si, Ti, Al, Li, Mg and Ca. The wiring conductor is reflow processed, such that at least one of the Sn and the oxidation control element is diffused to form an alloy.

Wiring conductor, method for fabricating same, terminal connecting assembly, and Pb-free solder alloy

A metallic material is rolled to provide a conductorhaving a rectangular cross section. A surface of the rectangular conductoris plated with a plating layer. A thickness of the plating layerat a surface facing to the Si cell is not more than 5 &#x3bc;m to provide a connecting lead wirefor a solar battery. The connecting lead wirefor a solar battery has 0.2% proof stress of not more than 60 MPa. The connecting lead wirefor a solar battery is connected to a predetermined contact region of a Si cellof a solar battery at a high temperature.

Connecting lead wire for a solar battery, method for fabricating same, and solar battery using the connecting lead wire

A fluororesin heated at a temperature at or above the melting point of the resin is exposed in an inert gas atmosphere having an oxygen concentration of not more than 10 Torr to an ionizing radiation at a radiation dose of 0.1 kGy to 10 MGy to prepare a crosslinked fluororesin. The crosslinked fluororesin is exposed to an ionizing radiation at a radiation dose of 10 kGy to 5 MGy, and is then brought into contact with a functional group-containing organic compound to cause a graft reaction. By virtue of this constitution, a modified fluororesin is provided which has satisfactory mechanical strength and, at the same time, has, imparted thereto, for example, ion-exchange capacity, hydrophilicity, adhesive property, or abrasion resistance.

Modified fluororesin and process for producing the same

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Hitachi, Japan

Hajime Nishi