Hitachi Chemical Dupont Microsystems, Ltd.

Hajime Nakano

Masayuki Ooe

Takumi Ueno

Masataka Nunomura

Yoshiko Tsumaru

Yasuharu Murakami

Hiroshi Matsutani

Takashi Hattori

Dai Kawasaki

Hiroshi Komatsu

Noriyuki Yamazaki

Nagatoshi Fujieda

Yoshiko Futagawa

Yoshika Satou

A resin composition includes: (A) a polymer having a structural unit shown by the formula (I), and an acidic functional group or a group derived therefrom at both of the terminals; wherein Xis a di- to octa-valent organic group, Yis a di- to octa-valent organic group, Ris a hydrogen atom or an organic group having 1 to 20 carbon atoms, Ris a hydrogen atom or a monovalent organic group, when plural Rs or Rs exist, the plural Rs or Rs may be the same or different, p and q are independently an integer of 0 to 4, l and m are independently an integer of 0 to 2, and n is an integer of 2 or more indicating the number of structural units; (B) a solvent; and (C) a compound shown by formula (II) wherein Ris a monovalent organic group.

Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components

A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (&#x2014;NH) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.

Photosensitive polymer composition, method of forming relief patterns, and electronic equipment

A positive-type photosensitive resin composition for electronic materials having good film adhesiveness and sensitivity without causing a corrosion reaction to copper and copper alloys in metal wirings, a method for producing patterns and electronic parts are provided. The positive-type photosensitive resin composition includes (A) a polybenzoxazole precursor having a structure represented by the following general formula (I): wherein X represents a bivalent organic group, Y represents a tetravalent organic group, Rrepresents a hydrogen atom or a monovalent organic group, and m represents an integer of 2 to 500 which represents a repeating unit number of the polymer, (B) a solvent, (C) a tetrazole derivative and (D) a compound which generates an acid by light.

Positive-type photosensitive resin composition, method for producing patterns, and electronic parts

A heat resistant photosensitive resin composition having excellent film properties is provided by constituting a photosensitive resin composition containing (A) a polymer having an acid functional group and/or a substituent derived therefrom, (B) a compound having at least one substituent derived from an amine functional group, (C) a photoreactive compound, and (D) a solvent. Using this composition, a pattern with high resolution can be produced, and thus an electronic part having a high quality can be produced.

Heat-resistant photosensitive resin composition, method for forming pattern using the composition, and electronic part

Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280&#xb0; C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.

Positive photosensitive resin composition, method for forming pattern, and electronic part

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Ibaraki, Japan

Hajime Nakano