Nec Corporation

Dai Nippon Printing Co., Ltd.

Nippon Kokan Kabushiki Kaisha

Kabushiki Kaisha Toshiba

Konica Minolta, Inc.

Hajime Mori

Jun Suzuki

Kenji Takahashi

Akira Ito

Satoshi Yamamoto

Yoshihiko Kawai

Noboru Saito

Shigeru Kasai

Yasuhiro Sakai

Yoshiteru Kikuchi

Teruyuki Hasegawa

Yukio Yamaguti

Yuichi Motora

Yuusuke Watanabe

Tomoki Fujita

Toshio Yokota

Kenzi Kobayashi

Minoru Hirano

A semiconductor device having an IC (Integrated Circuit) chip packaged on a circuit board, and a cap for hermetically sealing the chip. The cap is bonded to the circuit board at the edges of an open end thereof and bonded to the chip at the underside or bottom thereof. To accurately position the chip on the circuit board, the circuit board is provided with a groove or a shoulder in a position where it faces the edges of the open end of the cap. After the chip has been positioned on the circuit board, the cap is bonded to the circuit board via the groove or the shoulder.

Semiconductor device package having locating mechanism for properly

Light converging filter and method for manufacturing the same

A method for melting and reducing chrome ore, which comprises charging chrome ore and carbonaceous material, and blowing in oxygen gas under a pressure ranging from 1 to 600 Torr, while molten metal is being stirred by a stirring gas blown in. In this method, a reaction vessel capable of allowing top blowing and bottom blowing onto the molten metal and decreasing pressure within the vessel is employed. Chrome ore and carbonaceous material can be used in the form of lumps or powder. When powdered ore and material are used, they can be injected through a lance or a tuyere into the vessel.

Method for melting and reducing chrome ore

Growing community of inventors

Tokyo, Japan

Hajime Mori