Nikon Corporation

Hajime Mitsuishi

Isao Sugaya

Minoru Fukuda

Kazuya Okamoto

Hidehiro Maeda

Atsushi Kamashita

Masaki Tsunoda

Ikuhiro Kuwano

Hiroshi Shirasu

Masashi Okada

Yoshiaki Kito

Mikio Ushijima

Eiji Ariizumi

Masanori Aramata

Naoto Kiribe

Yoshihiro Maehara

An alignment method for aligning two substrates to be stacked, comprising measuring a position of a mark selected from plurality of marks disposed on at least one substrate of the two substrates and aligning the two substrates based on the position of the measured mark, wherein the mark to be measured is selected based on information relating to distortion of the at least one substrate. The mark may be a mark disposed in a region having a smaller distortion amount of the at least one substrate than a threshold. The mark may be a mark disposed in a region having a higher reproducibility of distortion that occurs in the at least one substrate than a threshold.

Alignment method and alignment apparatus

A bonding method including firstly bonding a first substrate to a second substrate by releasing a holding of the first substrate to form a first stack; and secondly bonding one substrate, which has been thinned, among the first substrate and the second substrate that have been bonded, to a third substrate, to form a second stack, wherein when the first substrate is thinned, the holding of the third substrate is released at the second bonding, and when the second substrate is thinned, the holding of the first stack is released at the second bonding.

Bonding method and bonding device

A substrate holder includes a central support portion configured to support a central portion of a substrate, and an circumferential support portion arranged on an outside of the central support portion and configured to support a circumferential portion on an outside of the central portion, and the circumferential support portion is configured to support the circumferential portion so that at least a partial region of the circumferential portion is curved toward the substrate holder with a curvature greater than that of the central portion.

Substrate bonding apparatus and substrate bonding method

A manufacturing method is provided, which includes processing at least one of a plurality of substrates; stacking the plurality of substrates to manufacture a stacked substrate; and correcting, in the processing, a part of an amount of positional misalignment that is generated among a plurality of substrates in the stacking and correcting, in the stacking, at least a part of the remainder of the amount of positional misalignment.

Method and device for manufacturing stacked substrate

A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.

Apparatus for stacking substrates and method for the same

A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.

Bonding method, bonding device, and holding member

A method of manufacturing a stacked substrate by bonding a first substrate and a second substrate, including a step of determining, based on information about curving of each of the first substrate and the second substrate, whether or not the first substrate and the second substrate satisfy a predetermined condition, and, a step of bonding the first substrate and the second substrate if the predetermined condition is satisfied. The stacked substrate manufacturing method described above includes a step of estimating, based on the information, an amount of misalignment which occurs after the first substrate is bonded to the second substrate and the predetermined condition may include that the amount of misalignment is equal to or less than a threshold.

Stacked substrate manufacturing method, stacked substrate manufacturing apparatus, stacked substrate manufacturing system, and substrate processing apparatus

A stacking apparatus that stacks substrate and a second substrate includes: a plurality of holding members that hold the first substrate, wherein the plurality of bolding members correct positional misalignment of the first substrate relative to the second substrate by preset amounts of correction, and the plurality of holding members include holding members having the amounts of correction that are different from each other. The stacking apparatus may further include a carrying unit that carries a holding member that is selected from among the plurality of holding members and holds the first substrate from a position here the holding member is housed to a position where the first substrate is held.

Stacking apparatus and stacking method

To improve the throughput of substrate bonding. A substrate bonding apparatus that bonds first and second substrates so that contact regions in which the first and second substrates contact are formed in parts of the first and second substrates and the contact regions enlarge from the parts, the apparatus including: a detecting unit detecting information about the contact regions; and a determining unit determining that the first and second substrates can be carried out based on the information detected at the detecting unit. In the substrate bonding apparatus, the information may be information, a value of which changes according to progress of enlargement of the contact regions, and the determining unit may determine that the first and second substrates can be carried out if the value becomes constant or if a rate of changes in the value becomes lower than a predetermined value.

A manufacturing method for manufacturing a stacked substrate by bonding two substrates includes: acquiring information about crystal structures of a plurality of substrates; and determining a combination of two substrates to be bonded to each other, based on the information about the crystal structures. In the manufacturing method described above, the information about the crystal structures may include at least one of plane orientations of bonding surfaces and crystal orientations in a direction in parallel with the bonding surfaces. In the manufacturing methods described above, the determining may include determining a combination of the two substrates with a misalignment amount after bonding being equal to or smaller than a predetermined threshold.

Manufacturing method and manufacturing apparatus for stacked substrate, and program

A stacking apparatus that stacks a first substrate and a second substrate includes: a plurality of holding members that hold the first substrate, wherein the plurality of holding members correct positional misalignment of the first substrate relative to the second substrate by preset amounts of correction, and the plurality of holding members include holding members having the amounts of correction that are different from each other. The stacking apparatus may further include a carrying unit that carries a holding member that is selected from among the plurality of holding members and holds the first substrate from a position where the holding member is housed to a position where the first substrate is held.

A substrate bonding apparatus that brings a part of a surface of a first substrate and a part of a surface of a second substrate into contact to form contact regions at the parts, and then enlarges the contact regions to bond the first substrate and the second substrate includes: a temperature adjusting unit that adjusts a temperature of at least one of the first substrate and the second substrate such that positional misalignment between the first substrate and the second substrate does not exceed a threshold at least in a course of enlargement of the contact regions.

Growing community of inventors

Yokohama, Japan

Hajime Mitsuishi