Tdk Corporation

Hajime Kuwajima

Akira Furuya

Masahiro Miyazaki

Masashi Gotoh

Takashi Ohtsuka

Yuichiro Okuyama

Takeshi Oohashi

Hiroshi Yamamoto

Makoto Shibata

Kenichi Yoshida

Kazuhiro Yoshikawa

Masahiro Itoh

Hitoshi Ohkubo

Hiroki Hara

Jitsuo Kanazawa

Kenichi Kawabata

Kaoru Kawasaki

Toshiyuki Yoshizawa

Tomonaga Nishikawa

Manabu Ohta

Mutsuko Nakano

Masami Sasaki

Qiang Richard Chen

Toshiyasu Fujiwara

Shinichiro Toda

Yukio Mitake

Manabu Yamatani

Yoshikazu Tsuya

Naoto Ohyama

Masaomi Ishikura

Disclosed herein is an electronic component that includes a substrate, a planarizing layer covering a surface of the substrate, a first conductive layer formed on the planarizing layer and having a lower electrode, a dielectric film made of a material different from that of the planarizing layer and covering the planarizing layer and first conductive layer, an upper electrode laminated on the lower electrode through the dielectric film, and a first insulating layer covering the first conductive layer, dielectric film, and upper electrode. An outer periphery of the first insulating layer directly contacts the planarizing layer without an intervention of the dielectric film.

Electronic component configured to relax internal stresses due to changes in temperature and manufacturing method of the same

Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.

Electronic component and its manufacturing method

Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.

Multilayer wiring structure and its manufacturing method

An LC composite component includes one or more inductors, one or more capacitors, a magnetic layer, and a substrate. The substrate has a first surface, and a second surface opposite to the first surface. The magnetic layer is disposed to face the first surface of the substrate. The one or more inductors are disposed between the first surface of the substrate and the magnetic layer. The substrate has a thickness greater than that of the magnetic layer in a direction perpendicular to the first surface of the substrate. The substrate has a complex permeability having a real part and an imaginary part that are respectively smaller than the real part and the imaginary part of the complex permeability of the magnetic layer.

LC composite component

A directional coupler has a first line capable of transmitting a high-frequency signal therethrough and a second line arranged for electromagnetic coupling with the first line in a laminated board. The first line and the second line are routed on a first conductor layer to extend in close proximity to and in parallel with each other, to form an intra-layer coupling zone for developing electromagnetic coupling between the first line and the second line. The second line is routed on a second conductor layer such that the second line partially overlaps with the first line disposed on the first conductor layer with respect to a length-wise direction, when viewed in plan, to form an inter-layer coupling space for developing electromagnetic coupling between the second line on the second conductor layer and the first line on the first conductor layer.

Directional coupler

A directional coupler according to the present invention includes a primary line for transmitting a transmission signal; an input port for inputting the transmission signal to the primary line; an output port for outputting the transmission signal from the primary line; a secondary line for electromagnetically coupling with the primary line to extract part of the transmission signal; a coupling port provided at one end of the secondary line; an isolation port provided at the other end of the secondary line; and a low pass filter unit having a function of low pass filter, disposed between the secondary line and the coupling port.

Directional coupler and wireless communication device

A thin-film device incorporates a device main body and four terminal electrodes. The device main body has four side surfaces. The terminal electrodes are disposed to touch respective portions of the side surfaces. The device main body includes a lower conductor layer that is not used to form a passive element, and an upper conductor layer used to form the passive element. The upper and lower conductor layers include respective lead electrode portions that have respective end faces located at the side surfaces of the device main body. At the side surfaces of the device main body, the end face of the lead electrode portion of the lower conductor layer and the end face of the lead electrode portion of the upper conductor layer are electrically and physically connected to each other. The terminal electrodes touch these end faces and are thereby connected to the upper and lower conductor layers.

Thin-film device including a terminal electrode connected to respective end faces of conductor layers

A masking apparatus includes a mask base body and a mask plate. The mask base body includes at least one spacer plate, and a cavity in which an electronic component can be housed. The mask plate is disposed on an upper surface and/or a lower surface of the mask base body. The mask plate includes a film-forming opening with a shape corresponding to the shape of an external structural body to be formed on an outer surface of the component. The mask plate thus allows a film-forming operation to be selectively performed on the outer surface of the component through the film-forming opening. The cavity includes, in an inner surface thereof, a film-forming groove communicating with the film-forming opening so that the external structural body can be formed at once on an upper surface and/or a lower surface of, and also on a peripheral surface of the component.

Masking apparatus and method of fabricating electronic component

An insulating sheet including resin is attached to a conductor portion composed of a wiring pattern and a columnar conductor from above. Then pressure and heat are applied to the insulating sheet using the columnar conductor as a stopper to form a layer of resin having a uniform thickness with the height of the columnar conductor being a reference to cover the conductor portion. In such method for manufacturing an electronic part, a projecting portion is formed outside a part formation area. In this substrate sheet, the amount of the resin required for forming the layer is computed based on the proportion of the volume taken up by the conductor portion in a domain including the projecting portion, and the thickness of the insulating sheet is set in accordance with the computed resin amount.

Method for manufacturing an electronic part

The invention is to provide an electronic component which can obtain the capacitance value of a capacitor element highly precisely. An electronic component has a lower conductor (first conductor) which is formed on a planarized layer of a substrate, a dielectric film which is formed on the lower conductor, and an upper conductor (second conductor) which is formed on the dielectric film and thinner than the lower conductor. A capacitor element (capacitative element) is configured of the lower conductor, the dielectric film and the upper conductor.

Electronic component

A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.

Method for manufacturing electronic components

The method for manufacturing an electronic part includes a step of forming an opening hole onto an insulating member sandwiched between a conductor film and a lower conductor layer, from the conductor film, a step of making a surface of the lower conductor layer adhering the insulating member as bottom of the opening hole, and making a metal plating as a conductor portion grow in the opening hole from the lower conductor layer. In the method, after metal plating has reached the conductor film, the metal plating is grown on the conductor film and the conductor portion as electrode, to thereby form a thickness enough to form an upper conductive layer.

Method of manufacturing electronic part and electronic part

The invention provides an electronic component which has an improved breakdown limit value of withstand voltage and improved insulation properties and which can be made compact and provided with a multiplicity of layers and a great capacity. The electronic component includes a first conductor having a bottom conductor formed on a substrate and a raised conductor formed to protrude from the bottom conductor, a dielectric film formed on the raised conductor, and a second conductor formed on the dielectric film to constitute a capacitor element in combination with the raised conductor and the dielectric film.

Electronic component comprising a coil conductor and a capacity element

An electronic component is provided with a first conductor, an insulator for covering a surface of the first conductor, a via hole penetrating the insulator, and a second conductor located on a surface of the insulator and electrically connected to the first conductor through the via hole, and includes a shielding film having conductivity, being interposed between the first conductor and the second conductor, and covering an interface between the first conductor and the insulator in the via hole by extending continuously at least from the surface of the first conductor constituting a bottom surface of the via hole to an inner wall surface of the via hole.

Growing community of inventors

Tokyo, Japan

Hajime Kuwajima