Sanyo Electric Co., Ltd.

Pioneer Corporation

Jaguar International Corporation

Hajime Kobayashi

Yasuyuki Yanase

Toshimichi Naruse

Ryosuke Usui

Yoshio Okayama

Hideki Mizuhara

Tetsuya Yamamoto

Takehiko Shioda

Koichi Saito

Mayumi Nakasato

Shinichi Gayama

Soichi Toyama

Nobuhisa Takakusaki

Yasunori Suzuki

Yoshihiro Kogure

Toshio Tabata

Toshiya Shimizu

Yoshihiro Kawazoe

Takayuki Hasegawa

A semiconductor element mounted on an insulating resin layer formed on a wiring layer is sealed by a sealing resin. On the wiring layer, a protruding electrode protruding to the side of the semiconductor element and a protruding section are integrally formed with the wiring layer, respectively. The protruding electrode is electrically connected to an element electrode of the semiconductor element by penetrating the insulating resin layer. The protruding section is arranged to surround the semiconductor element along the four sides of the semiconductor element, and is embedded in the sealing resin up to a position above a section where the protruding electrode and the element electrode are bonded.

Semiconductor module and portable apparatus provided with semiconductor module

The invention provides a solder structure which is least likely to develop Sn whiskers and a method for forming such a solder structure. The solder structure includes an Sn alloy capable of a solid-liquid coexistent state and an Au (or Au alloy) coating covering at least part of the surface of the Sn alloy. The Au covering is a film that covers and coats at least part of the surface of the Sn alloy. As a preferable mode, the Au coating forms a netlike structure on the surface of the Sn alloy. The thickness of the Au coating is, for instance, 1 to 5 &#x3bc;m.

Solder structure, method for forming the solder structure, and semiconductor module including the solder structure

A device mounting board includes: an insulating resin layer; a wiring layer disposed on one main surface of the insulating resin layer; and a bump electrode connected electrically to the wiring layer and protruding on a side of the insulating resin layer from the wiring layer. A side surface of the bump electrode is curved inwardly toward the center axis of the bump electrode as viewed in a cross section including the center axis of the bump electrode, and the radius of curvature of the side surface changes continuously from a wiring layer end to a head end of the bump electrode.

Device mounting board and manufacturing method therefor, and semiconductor module

There is provided a voice recognition device and a voice recognition method that enhance the function of noise adaptation processing in voice recognition processing and reduce the capacity of a memory being used. Acoustic models are subjected to clustering processing to calculate the centroid of each cluster and the differential vector between the centroid and each model, model composition between each kind of assumed noise model and the calculated centroid is carried out, and the centroid of each composition model and the differential vector are stored in a memory. In the actual recognition processing, the centroid optimal to the environment estimated by the utterance environmental estimation is extracted from the memory, model restoration is carried out on the extracted centroid by using the differential vector stored in the memory, and noise adaptation processing is executed on the basis of the restored model.

Speech recognition device and speech recognition method

An interactive information providing apparatus is provided with: an output component that provides an information requesting output for requesting a user for information; an input component that receives from the user input information to the information requesting output; and an interaction controller component that controls the output component and the input component according to a scenario, to carry on a dialogue with the user. In the apparatus, the interaction controller component changes a level at which the output component requests a user for information, according to an importance parameter associated with the scenario.

Interactive information providing apparatus, interactive information providing program, and storage medium having stored same

A circuit device is provided in which the bonding reliability of a brazing material such as soft solder is improved. A circuit device of the present invention includes conductive patterns, a bonding material which fixes circuit elements to the conductive patterns, and sealing resin which covers the circuit elements. The circuit device has a structure in which Pb-free solder containing Bi is used as the bonding material. Since the melting temperature of Bi is high in comparison with that of a general solder, the melting of the bonding material is suppressed when the circuit device is mounted. Further, Ag or the like may be mixed into the bonding material in order to enhance the wettability of the bonding material.

Bonding material and circuit device using the same

In order to prevent short-circuiting when a chip component is brazed to pads of a conductive wiring layer, a hybrid semiconductor circuit includes the chip component with terminal electrodes formed at both ends, a first conductive wiring layer on which the pads are provided such that they correspond to the terminal electrodes, and an overcoat resin that covers the first conductive wiring layer excluding the pads. The terminal electrodes of the chip component are adhered to the pads by a conductive adhesive and an insulating adhesive is provided between the pads.

Hybrid integrated circuit device with high melting point brazing material

A trained vector generation sectiongenerates beforehand a trained vector v of unvoiced sounds. An LPC Cepstrum analysis sectiongenerates a feature vector A of a voice within the non-voice period, an inner product operation sectioncalculates an inner product value VA between the feature vector A and the trained vector V, and a threshold generation sectiongenerates a threshold &#x3b8;v on the basis of the inner product value VA. Also, the LFC Cepstrum analysis sectiongenerates a prediction residual power &#x3b5; of the signal within the non-voice period, and the threshold generation sectiongenerates a threshold THD on the basis of the prediction residual power &#x3b5;. If the voice is actually uttered, the LPC Cepstrum analysis sectiongenerates the feature vector A and the prediction residual power &#x3b5;, the inner product operation sectioncalculates an inner product value VA between the feature vector A of input signal Saf and the trained vector V, and a threshold determination sectioncompares the inner product value VA with the threshold &#x3b8;v and determines the voice section if &#x3b8;v&#x2266;VA. Also, a threshold determination sectioncompares the prediction residual power &#x3b5; of input signal Saf with the threshold THD and determines the voice section if THD&#x2266;&#x3b5;. The voice section is finally defined if &#x3b8;v&#x2266;VA or THD&#x2266;&#x3b5;, and the input signal Svc for voice recognition is extracted.

Speech recognition system including speech section detecting section

A sewing machine capable of preventing formation of no first stitch (skipping stitch), which is readily caused immediately after the sewing machine starts to operate, is obtained. In this sewing machine, a motor is so stopped as to locate a thread engaging part of a balance in the vicinity of a forward movement starting point leftward beyond a thread receiving opening of a thread guide plate. Thus, the thread engaging part of the balance reliably captures and pulls a needle thread immediately after the sewing machine starts to operate. Consequently, formation of no first stitch (skipping stitch), which is readily caused immediately after the sewing machine starts to operate, is prevented.

Sewing machine having balance

A sewing machine capable of preventing formation of no first stitch (skipping stitch), which is readily caused immediately after the sewing machine starts to operate, is obtained. This sewing machine comprises a first detector detecting that a thread engaging part of a balance is located in the vicinity of a forward movement starting point leftward beyond a thread receiving opening of a thread guide plate and an indicator operating on the basis of a detection signal received from the first detector. Thus, the operator can recognize that the thread engaging part of the balance is located in the vicinity of the forward movement starting point leftward beyond the thread receiving opening of the thread guide plate through the indicator. When the operator moves the balance to a position for turning on the indicator, guides a needle thread and thereafter operates the sewing machine, therefore, the thread engaging part of the balance reliably captures and pulls the needle thread also immediately after the sewing machine starts to operate. Consequently, formation of no first stitch (skipping stitch), which is readily caused immediately after the sewing machine starts to operate, is prevented.

Growing community of inventors

Moriguchi, Japan

Hajime Kobayashi