Hitachi Chemical Company, Ltd.

Adeka Argus Chemical Co., Ltd.

Dai Nippon Toryo Co., Ltd.

Asahi Denka Kogyo Kabushiki Kaisha

Asahi Denka Kogyo K.k.

Hajime Kakumaru

Hiroyuki Tanaka

Seiji Tai

Takeshi Nojiri

Seikichi Tanno

Yoshitaka Minami

Hideyasu Tsuiki

Naohiro Kubota

Nobuyuki Hayashi

Koichi Kamijima

Shinya Mashimo

Toshiaki Ishimaru

Ikuo Mukai

Kazuya Sato

Naoki Kimura

Yumiko Wada

Tomohisa Ohta

Katsushige Tsukada

Toshihiko Akahori

Nobuhide Tominaga

Toshihiko Shiotani

Kiyoshi Nakao

Masahiko Hiro

Yoshihisa Nagashima

Takuro Kato

Toshiya Takahashi

Hideo Yamada

Koji Ishizaki

Yuhji Yamazaki

Sigeo Tachiki

Disclosed are a phosphor pattern which comprises a substrate having unevenness and a phosphor layer formed on the inner surface of a concave portion of the substrate, wherein the phosphor pattern thickness ratio (x)/(y) satisfies a range of 0.1 to 1.5, where when the length from the bottom of the concave portion to the top of a convex portion is L (&mgr;m), (x) is a thickness of the phosphor pattern formed on an uneven wall surface at a position of 0.9&times;L from the bottom of the concave portion toward the top of the convex portion, and (y) is a thickness of the phosphor pattern formed on the uneven wall surface at a position of 0.4&times;L from the bottom of the concave portion toward the top of the convex portion, and processes for preparing the same.

Photosensitive element for preparing a phosphor pattern

Phosphor pattern, processes for preparing the same and photosensitive element to be used for the same

Photosensitive resin composition, photosensitive film and process for preparing fluorescent pattern using the same

Disclosed are a photosensitive resin composition which comprises:

Photosensitive resin composition, photosensitive film and process for

A resist pattern good in resolution and image precision can be obtained by a developing process characterized by jetting a gas on a developing surface during development or after development.

Developing process

A negative type photosensitive electrodepositing resin composition comprising (a) a polymer obtained by neutralizing a copolymer of acrylic or methacrylic acid and having an acid number of 20 to 300 with a basic organic compound, (b) a non-water-soluble monomer having two or more photopolymerizable unsaturated bonds in the molecule, (c) a non-water-soluble photoinitiator, and (d) a benzotriazole derivative having one or more carboxyl groups, is effective for giving electrodeposited films with a low voltage or low electric current in a short time, and usable for forming resist patterns with high degree of resolution.

Negative type photosensitive electrodepositing resin composition

Photopolymerizable composition and photopolymerizable element

Acridine compounds such as 1,4-butylenebis-.beta.-(acridin-9-yl)acrylate, or the like, are high in light sensitivity and suitable as a photopolymerization initiator.

Photopolymerizable composition and processes using acridine

A substituted acridine derivative represented by ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.6, R.sub.7 and R.sub.8 are independently hydrogen atoms, alkyl groups, substituted alkyl groups, aryl groups, substituted aryl groups, halogen atoms, or alkoxy groups, and Z.sub.1 is a six-membered heteroaromatic group which has one or two nitrogen atoms in its ring and may have an alkyl substituent having 1 to 8 carbon atoms, or a quinolyl group; and a photopolymerizable composition comprising 0.01 to 10 parts by weight of said derivative, 100 parts by weight of a photopolymerizable compound having a boiling point of 100.degree. C. or higher at atmospheric pressure and at least one kind of ethylenic unsaturated group, and 0 to 400 parts by weight of a thermoplastic organic polymer.

Substituted acridine derivatives and application thereof

Acridine compounds such as 1,4-butylene-bis-.beta.-(acridin-9-yl)acrylate, or the like are high in light sensitivity and suitable as a photopolymerization initiator.

Acridine compound and photopolymerizable composition using the same

Photosensitive composition comprising (a) an addition polymerizable compound of the general formula: ##STR1## wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are hydrogen atom or methyl group, and n+m=8 to 12, (b) an addition-poymerizable compound of the general formula: ##STR2## wherein Z is a cyclic dibasic acid residue, R.sup.5 is a C.sub.1 to C.sub.3 alkylene group, R.sup.6 is hydrogen atom or methyl group, and R.sup.7 is hydrogen atom, methyl group, ethyl group or CH.sub.2 X in which X is chlorine atom or bromine atom, (c) a photoactivatable polymerization initiator, and (d) a linear copolymer having a carboxy content of 17 to 50% by mole, a water absorption of 4 to 30% by weight and a weight average molecular weight of 30,000 to 400,000. Photosensitive laminate having a photosensitive layer formed from the composition has an excellent resistance to plating liquids as well as excellent etching resistance, chemical resistance, adhesion property to boards and developing property.

Aqueous alkali developable photosensitive composition and photosensitive

A process for producing adhesive film comprising coating on a filmlike substrate a composition comprising (i) a copolymer having a glass transition temperature of -30.degree. C. or lower and obtained from one or more monomers (a) such as alkyl acrylates or methacrylates, or the like, and another monomers (b) containing at least one carboxyl, alcoholic hydroxyl, or glycidyl group, (ii) a crosslinking agent having at least two crosslinkable functional groups which can react with the monomers (b), (iii) one or more monofunctional addition polymerizable monomers having a boiling point of 200.degree. C. or higher, (iv) one or more polyfunctional addition polymerizable monomers having a boiling point of 200.degree. C. or higher, and (v) a photochemical initiator, and irradiating said composition with actinic light, is advantageous in that the amount of solvent to be removed after coating the composition on the substrate can be reduced remarkably without lowering properties of the resulting adhesive film.

Process for producing adhesive film

A photosensitive resin composition comprising (a) a linear polymer or copolymer having tetrahydrofurfuryl groups at side chains, (b) one or more photopolymerizable unsaturated compounds having at least two terminal ethylene groups, and (c) one or more sensitizers which initiate polymerization of said unsaturated compounds by irradiation of active light, has excellent storage stability and photosensitivity. The composition can produce permanent protective films having excellent resistance to solvents, heat resistance and the like and can be used as a solder resist and the like.

Photosensitive resin composition

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Hitachi, Japan

Hajime Kakumaru