Sony Corporation

Hitachi Consumer Electronics Co., Ltd.

Canon Kabushiki Kaisha

Hitachi, Ltd.

Sony Electronics Inc

Sony Group Corporation

Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Other

Fujitsu Corporation

Sony Interactive Entertainment Inc.

Hitachi Chemical Company, Ltd.

Fujitsu Hitachi Plasma Display Limited

Hitachi Microcomputer Engineering, Ltd.

Saturn Licensing LLC

Hajime Inoue

Keiji Kanota

Yukio Kubota

Takahito Seki

Keiji Tatani

Taku Umebayashi

Ryuichi Kanamura

Satoshi Ouchi

Yoshiho Seo

Koichi Sakita

Akira Shimazu

Tatsuya Wakahara

Ichiro Hamada

Masao Mizutani

Tadayoshi Kosaka

Toshimichi Nagashima

Naoki Murayama

Chuen-Chien Lee

Iwao Yamamoto

Mayumi Nagayoshi

Kazushige Takagi

Naofumi Yanagihara

Hiroshi Okada

Takao Takahashi

Yasunobu Hashimoto

Noriyuki Yamamoto

Hidenao Kubota

Naoki Itokawa

Takeo Morinaga

Koichi Goto

Hisato Shima

Takehiko Nakano

Masaki Oguro

Seiji Murata

Susumu Nagano

Akihiro Uetake

Yoshiharu Yamashita

Tadashi Takano

Sunao Furui

Shinji Kakuyama

Moriyuki Kawaguchi

Sadaharu Sato

Ichiro Okamoto

Chihoko Takizawa

Tetsujiro Kondo

Masashi Nakamura

Keiichi Betsui

Shoji Yamamoto

Hiroki Ota

Shinichi Hasegawa

Yoshio Miyazaki

Hisayoshi Moriwaki

Keiji Yuzawa

Kissei Matsumoto

Kazutoshi Kobayashi

Minoru Hasegawa

Koji Iijima

Shinya Fukuta

Kazuyuki Ogawa

Atsushi Iwamura

Yoichirou Senshu

Kazunobu Chiba

Nobuhiko Tanaka

Katsuya Irie

Tomonari Misawa

Shinji Takada

Ayumu Nemoto

Koichi Oyama

Fumio Harada

Toshio Ibi

Haruhiko Yata

Kunihiro Suto

Hiroyuki Ishimaru

Naosuke Sumi

Yasushi Tamada

Kiyoshi Shimizu

Naoki Honda

Mingning Gu

Osamu Matsumura

Hiroshi Iwasa

Shoji Ichiki

Chien-Chien Lee

Syoji Oikawa

Kazunobu Kato

Tatsuaki Ueno

Yasuaki Ohta

Reiko Nagano

A semiconductor device including a first semiconductor section including a first wiring layer at one side thereof, the first semiconductor section further including a photodiode, a second semiconductor section including a second wiring layer at one side thereof, the first and second semiconductor sections being secured together, a third semiconductor section including a third wiring layer at one side thereof, the second and the third semiconductor sections being secured together such the first semiconductor section, second semiconductor section, and the third semiconductor section are stacked together, and a first conductive material electrically connecting at least two of (i) the first wiring layer, (ii) the second wiring layer, and (iii) the third wiring layer such that the electrically connected wiring layers are in electrical communication.

Semiconductor device, solid-state imaging device and electronic apparatus

An interchangeable lens attachable to and detachable from an image pickup apparatus that includes a single image sensor includes a plurality of lens units that include a first lens unit and a second lens unit, and a communication unit configured to transmit to the image pickup apparatus information for setting an imaging area acquired by the first lens unit that is used in monaurally displaying image to a photometric area.

Interchangeable lens and image pickup apparatus

A robot includes heat-generating members such as an actuator in spaces surrounded by exterior members. A heat-transfer section transfers heat of the heat-generating members to the exterior members. A heat-transfer control section adjusts the amount of heat transfer between the heat-generating members and the exterior members by operating the heat-transfer section. The heat-transfer section has a thermally conductive member that can shift between a coupling position for thermally coupling the heat-generating members and the exterior members, and an interrupting position for interrupting thermal conduction between the heat-generating members and the exterior members.

Robot

A lens apparatus is detachably attachable to an image pickup apparatus. The lens apparatus includes a notification unit configured to notify the image pickup apparatus of a type of the lens apparatus, and at least one processor or circuit configured to execute a plurality of tasks including a communication task configured to communicate with the image pickup apparatus. Via communication with the image pickup apparatus, the communication task transmits setting information for setting a white detection area to a white detection area different from a white detection area that corresponds to the type of the lens apparatus and is stored in the image pickup apparatus.

Lens apparatus, image processing apparatus, image pickup apparatus, control method for lens apparatus, image processing method, and memory medium

A driving apparatus includes a movable portion, a fixed portion configured to hold the movable portion, and a controller configured to control a position of the movable portion relative to the fixed portion. At least part of the outer surface of the movable portion is a spherical surface. The fixed portion includes a plurality of vibrators configured to press and contact the spherical surface of the movable portion and to rotate the movable portion, and a pressure receiver configured to hold pressure contact states of the plurality of vibrators against the movable portion. The movable portion is held by the plurality of vibrators and the pressure receiver, and a spherical center of the spherical surface of the movable portion is located between a plane passing through the plurality of vibrators and the pressure receiver.

Driving apparatus

A power receiving apparatus includes a determination unit and a display unit. The determination unit determines whether or not each of a power transmitting apparatus and a cable connected to the power receiving apparatus meets a predetermined condition relating to safety of power transmission. The display unit displays first information indicating that the power transmitting apparatus does not meet the predetermined condition in a case where the power transmitting apparatus does not meet the predetermined condition. The display unit displays second information indicating that the cable does not meet the predetermined condition in a case where the cable does not meet the predetermined condition.

Power receiving apparatus, control method, and storage medium

An electronic apparatus comprises a first battery authentication unit that performs a battery authentication process for authenticating a battery pack connected to the electronic apparatus, a second battery authentication unit that performs the battery authentication process, a first control unit that performs an activation process and controls the first battery authentication unit to perform the battery authentication process after the activation process ends, and a second control unit that controls the second battery authentication unit to perform the battery authentication process while the first control unit is performing the activation process.

Electronic apparatus and control method

An image stabilizing apparatus comprises: a shake detector that detects shake; an image stabilizer that corrects the shake by moving a position on the basis of the shake detected by the shake detector; a position detector that detects and outputs the position of the image stabilizer; a determinator that determines an extraction timing at which to extract the position of the image stabilizer on the basis of a timing at which an image sensor which shoots an image is exposed; and an extractor that extracts the position of the image stabilizer, from the output of the position detector, at the extraction timing determined by the determinator.

Image stabilizing apparatus, image processing apparatus, and detection method

An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The present invention relates to a sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less; and the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200&#xb0; C. or more. The sintered product of the sinterable bonding material of the present invention is excellent in bonding strength and heat-release characteristics, and has an improved stress relaxation ability.

Sinterable bonding material and semiconductor device using the same

The present invention can provide a controlled drug release carrier formed by using a silk fibroin porous material, which has high drug controlled release rate, controllability of the drug controlled release speed, high strength, easy handleability, skin care properties from high biocompatibility, high water retentivity, and capability of efficiently retaining a drug.

Controlled release carrier for drugs containing silk fibroin porous material

Growing community of inventors

Chiba, Japan

Hajime Inoue