Shinko Electric Industries Co., Ltd.

Hajime Iizuka

Koichi Tanaka

Tetsuya Koyama

Takaharu Yamano

Tadashi Arai

Hideaki Sakaguchi

Tsuyoshi Kobayashi

Yuji Kunimoto

Nobuyuki Kurashima

Toshio Kobayashi

Kiyoaki Iida

Tomoaki Mashima

Takashi Yanagisawa

Mitsutoshi Higashi

Naoyuki Koizumi

Masatoshi Akagawa

Satoshi Shiraki

Osamu Uehara

Syoichi Kobayashi

Takehiko Arai

Kei Murayama

Masahiro Sunohara

An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Electronic part embedded substrate and method of producing an electronic part embedded substrate

Chip embedded substrate and method of producing the same

An electronic component incorporated substrate includes a first substrate and a second substrate electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. A first encapsulating resin is formed between the first substrate and the second substrate to encapsulate the electronic component. A second encapsulating resin is formed on a first surface of the first encapsulating resin to fill a space between the first encapsulating resin and the second substrate. The spacer unit includes a stacked structure of a first solder ball, a metal post, and a second solder ball stacked in a stacking direction of the first substrate and the second substrate.

Electronic component incorporated substrate and method for manufacturing electronic component incorporated substrate

An electronic component incorporated substrate includes a first substrate and a second substrate that are electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. An encapsulating resin fills a space between the first substrate and the second substrate to encapsulate the electronic component. The spacer unit includes a stacked structure of a metal post and a solder ball stacked in a stacking direction of the first substrate and the second substrate. The spacer unit further includes an insulation layer that is formed on the second substrate and covers a side wall of the metal post.

Electronic component incorporated substrate

An electronic device includes a first wiring substrate including a component mounting area, a second wiring substrate stacked on the first wiring substrate, in which an opening portion is provided in a part corresponding to the component mounting area, and connected to the first wiring substrate via solder bumps which are arranged on a periphery of the component mounting area, a frame-like resin dam layer formed between the solder bumps on the periphery of the component mounting area, and surrounding the component mounting area, and an electronic component mounted on the component mounting area of the first wiring substrate, wherein a sealing resin is filled between the first wiring substrate and the second wiring substrate such that the component mounting area is formed as a resin non-forming area by the resin dam layer.

Electronic device and method of manufacturing the same

A built-in electronic component substrate includes a first substrate, an electronic component including side surfaces and mounted on the first substrate, a first resin provided on the first substrate and covering the side surfaces of the electronic component, a second substrate provided above the electronic component and the first resin and layered on the first substrate, a substrate connection member provided between the first and the second substrates and electrically connecting the first and the second substrates, a second resin filling in between the electronic component and the second substrate and in between the first resin and the second substrate, and a third resin filling in between the first and the second substrates and encapsulating the substrate connection member, the electronic component, the first resin, and the second resin.

Built-in electronic component substrate and method for manufacturing the substrate

A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.

A circuit substrate having a mounting surface on which a semiconductor chip is mounted and at least one connection pad formed on the mounting surface is connected to a support plate having at least one mounting portion with a diameter larger than a diameter of the connection pad, through a truncated-cone-shaped solder layer which is formed from at least one solder ball on the basis of a difference between the diameter of the mounting portion and the diameter of the connection pad.

Semiconductor device

A wiring board includes an insulating layer in which a semiconductor chip is embedded, and a wiring structure connected to the semiconductor chip. A reinforcing member reinforcing the insulating layer is embedded in the insulating layer. This enables reduction in a thickness of the wiring board and a suppression of warpage of the wiring board.

Wiring board and method of manufacturing the same

There are provided the steps of mounting a semiconductor chip on a first substrate, providing an underfill resin between the semiconductor chip and the first substrate, forming a through hole on a second substrate, providing an electrode on the second substrate, bonding the first and second substrates to include the semiconductor chip through the electrode, and filling a sealing resin between the first and second substrates at a filling pressure capable of correcting a warpage generated on the semiconductor chip and the first substrate while discharging air from the through hole.

Method of manufacturing electronic component integrated substrate

A semiconductor device in which a plurality of semiconductor chips are consolidated into one and which is provided with at least a set of rerouting wiring lines formed so as to interconnect electrodes of the respective semiconductor chips, the electrodes having a function which is common to the respective semiconductor chips, the set of rerouting wiring line having a common external connection terminal.

A method forwarding a semiconductor device that is excellent in bonding strength of bumps with respective protruded electrodes and having high reliability. A wiring pattern to be connected to an electrode of a semiconductor chip is formed on an insulting film formed on the semiconductor chip in which the electrode is formed. Protruded electrodes are formed on the wiring pattern . The wiring pattern is covered with a protective film , and a bump for external connection is formed on the end portion of each of the protruded electrodes exposed from the protective film . The bump is formed in such a manner that the bump is bonded to the at least entire end face of each of the protruded electrodes

Process for fabricating bump electrode

A semiconductor device excellent in bonding strength of bumps with respective protruded electrodes and having high reliability wherein a wiring pattern,to be connected to an electrode,of a semiconductor chip,is formed on an insulting film,formed on the semiconductor chip,in which the electrode,is formed, protruded electrodes,are formed on the wiring pattern,, the wiring pattern,is covered with a protective film,, and a bump,for external connection is formed on the end portion of each of the protruded electrodes,exposed from the protective film,, the bump,is formed in such a manner that the bump is bonded to the at least entire end face of each of the protruded electrodes

Growing community of inventors

Nagano, Japan

Hajime Iizuka