Kabushiki Kaisha Toshiba

Komatsu Corporation

Renesas Electronics Corporation

Fujitsu Semiconductor Limited

Hajime Aoyama

Hideo Kataoka

Naomi Kobayashi

Masakuni Ueda

Toshihiko Tanaka

Tsuneo Terasawa

Taiga Uno

Masayuki Ohishi

Yukiyasu Arisawa

Osamu Suga

Hiroyuki Shigemura

A wear resistant component includes a matrix portion made of metal, and a core that is embedded in the matrix portion and is higher in hardness than the matrix portion. The core has a shape that follows a shape of at least a portion of a surface of the matrix portion.

Wear resistant component

A wear resistant component includes a matrix portion made of metal, and a framework portion that is embedded in the matrix portion and is higher in hardness than the matrix portion. The framework portion has a three-dimensional lattice structure formed with a plurality of bar-shaped members, and has a shape that follows a shape of at least a portion of a surface of the matrix portion.

According to one embodiment, there is provided a control block including a read control processor for reading designated content, a time information processor for processing time information. A controller returns, to a user terminal, a response signal, and information indicating a second absolute time point when an operation is executed in response to a request signal generated by the user terminal at a first absolute time point. The controller stores time difference information indicating a time difference between the first and the second absolute time points. When responding to a further request signal sent from the requester via the network, the controller sets, as tag time information, time information obtained by correcting, using the time difference information, a current relative time period for which the designated content is read.

Recording/reading apparatus, method of generating tag list for recording/reading apparatus, and control unit for recording/reading apparatus

A inspection image data of the chip A is captured and the data representing the amount of correction of flare corresponded to the chip A is appropriately loaded from the map storage block. Next, a inspection image of the chip A' is captured, and the data representing the amount of correction of flare corresponded to the chip A&#x2032; is loaded from the flare map storage block as the amount of shifting of the edge of the contour of the pattern. The amount of correction is converted, by a correction data generation block which is a correction data generator, into the amount of geometrical correction of pattern which provides correction data. In the comparison block, the images of the geometry of two chips are compared and corrected on the amount of correction of flare generated by a correction data generation block, to thereby judge whether defect is found or not.

Method of inspecting mask pattern and mask pattern inspection apparatus

A method of correcting a flare comprising: calculating a distribution of a flare value corresponding to pattern data on the pattern data as a flare map; calculating an occupancy of a pattern having a predetermined flare value on the pattern data as a flare value occupancy for each flare value, by using the flare map; determining a reference flare value to be a reference of the flare value based on the distribution of the flare value occupancy; and performing a pattern correction corresponding to the flare value with a pattern correction amount at the reference flare value as a reference.

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Tokyo, Japan

Hajime Aoyama