Japan Display Inc.

Hitachi, Ltd.

Hitachi Displays, Ltd.

Panasonic Liquid Crystal Display Co., Ltd.

Nichia Corporation

Canon Kabushiki Kaisha

Pixtronix, Incorporated

Hitachi Device Engineering Co., Ltd.

Japan Dispaly Inc.

Panasonic Liquid Crystal Liquid Crystal Display Co., Ltd.

Hitacji Displays, Ltd.

Hajime Akimoto

Mitsuhide Miyamoto

Naruhiko Kasai

Hiroshi Kageyama

Tohru Kohno

Shigeyuki Nishitani

Toshihiro Sato

Masato Ishii

Takeo Shiba

Yoshiro Mikami

Yusuke Tada

Kiyoshige Kinugawa

Yoshirou Mikami

Shinichi Komura

Yuko Matsumoto

Toshio Miyazawa

Shinya Ohba

Toshihiko Itoga

Yoshiteru Shimizu

Toshihiro Satou

Toshifumi Ozaki

Takuma Nishinohara

Kenta Hiraga

Yuki Hamada

Mutsuko Hatano

Naoki Tokuda

Yasukazu Kimura

Chunche Ma

Kenta Kajiyama

Yasuyuki Kudo

Tohru Sasaki

Tsutomu Furuhashi

Yoshiyuki Kaneko

Mitsuru Hiraki

Makoto Tsumura

Shinya Yamaguchi

Takashi Akioka

Mitsuharu Tai

Norihiro Nakamura

Hitoshi Nakahara

Hideyuki Ono

Norio Manba

Hideo Sato

Masahiro Tanaka

Masaki Tanaka

Kouki Noguchi

Toshiaki Masuhara

Hajime Murakami

Takayuki Nakao

Toru Baji

Takahiro Nagano

Norio Koike

Tetsuya Nakagawa

Shigeru Sakamoto

Yoshiaki Toyota

Takayuki Ouchi

Takanori Aruga

Masaaki Nakai

Toshiyuki Matsuura

Motonobu Tonomura

Yasuharu Yatsu

Takahide Kuranaga

Wataru Kitahara

Hiroki Awakura

Takehide Furukawa

Ikuo Hiyama

Tsunenori Yamamoto

Genshiro Kawachi

Masamitsu Furuie

Masami Iseki

Akiharu Takabayashi

Kozo Katayama

Fujio Kawano

Hiroko Sehata

Nobuaki Hayashi

Hiroshi Miyairi

Noriharu Matsudate

Yoshihiro Kotani

Masakazu Gunji

Haruhisa Ando

Atsushi Kojima

Katsuyuki Funahata

Minoru Hoshino

Masahisa Tsukahara

Tetsuya Aoyama

Koji Yasukawa

Hideo Satou

Kazuhiro Kuwabara

Hiroshi Hatae

Takahiko Muneyoshi

Keiko Ono

Haruhiko Tanaka

Hsiang-Yuan Cheng

Gou Yamamoto

Yuya Shirahata

Takahiro Ichikawa

Hideki Ozawa

Hajime Kinugasa

Kazuya Tokumasu

Mitsuyuki Mitsui

An image display device includes: a first display device configured to output a first image representing an operation part for an apparatus; an imaging element configured to reflect the first image and to form the first image in mid-air as a mid-air image; a first sensor configured to detect an approach of a detection object to the mid-air image and to output a first signal; and a controller configured to output a second signal to the apparatus based on the first signal.

Image display device

A method for manufacturing an image display device includes: forming a conductive layer on a first substrate, wherein at least a part of the conductive layer is formed of a single-crystal metal; forming a semiconductor layer on said part of the conductive layer, the semiconductor layer comprising a light-emitting layer; forming a light-emitting element by patterning the semiconductor layer; forming a first insulating film that covers the first substrate, the conductive layer, and the light-emitting element; forming a circuit element on the first insulating film; forming a second insulating film that covers the first insulating film and the circuit element; exposing a surface that includes a light-emitting surface of the light-emitting element by removing a portion of the first insulating film and a portion of the second insulating film; and forming a wiring layer on the second insulating film.

Method for manufacturing image display device and image display device

A method for manufacturing an image display device according to an embodiment includes preparing a structure including a semiconductor layer formed on a first substrate, bonding the semiconductor layer to a first surface of a second substrate, removing the first substrate, forming a light-emitting element including a light-emitting surface opposite to a bottom surface on the first surface by etching the semiconductor layer, forming a first insulating film that covers the first surface and the light-emitting element, forming a circuit element on the first insulating film, forming a second insulating film that covers the circuit element and the first insulating film, exposing a surface including the light-emitting surface by removing a portion of the first and second insulating films, forming a via extending through the first and second insulating films, and forming a wiring layer on the second insulating film.

A light emitting device including a plurality of light emitting elements for emitting light of different colors depending on a drive current. The device includes a display, a current driver that supplies the drive current, a lighting controller that controls the current driver so that the light emitting elements emit light of a predetermined emission color and luminance, and an information storage that stores current-chromaticity information for determining a drive current value for driving the light emitting elements, in accordance with the emission color to be emitted by the light emitting elements. The lighting controller determines the drive current value for driving the light emitting elements and an ON period for lighting the light emitting elements by referring to the current-chromaticity information, in accordance with the predetermined emission color and gradation information, and performs lighting driving of the light emitting elements using the drive current from the current driver.

Light emitting device and method for driving light emitting device

An image display device manufacturing method includes: providing a first substrate that includes: a circuit including a circuit element formed on a light-transmitting substrate, and a first insulating film covering the circuit; forming, on the first insulating film, a layer including graphene; forming, on the layer v graphene, a semiconductor layer including a light-emitting layer; etching the semiconductor layer to form a light-emitting element; forming a second insulating film covering the layer including graphene, the light-emitting element, and the first insulating film; forming a via passing through the first insulating film and the second insulating film; and electrically connecting the light-emitting element and the circuit element through the via at a light-emitting surface facing a surface of the light-emitting element on a first insulating film side.

Image display device manufacturing method and image display device

A method for manufacturing an image display device includes: providing a second substrate that includes a first substrate, and a semiconductor layer grown on the first substrate, the semiconductor layer including a light-emitting layer; providing a third substrate including: a light-transmitting substrate, a circuit element formed on the light-transmitting substrate, a wiring layer connectable to the circuit element, and a first insulating film covering the circuit element and the wiring layer; bonding the semiconductor layer to the third substrate; forming a light-emitting element from the semiconductor layer; forming a second insulating film covering the light-emitting element; forming a via extending through the first and second insulating films; and electrically connecting the light-emitting element and the circuit element by the via. The wiring layer includes a light-reflective part. The light-emitting element is located on the light-reflective part.

An image display device includes: a display device configured to display an image; a liquid crystal element on which light emitted from the display device is incident, the liquid crystal element being configured to selectively allow one of P-polarized light or S-polarized light to exit the liquid crystal element; a reflective polarizing member configured to reflect the one of the P-polarized light or the S-polarized light that has exited the liquid crystal element and to transmit the other of the P-polarized light or the S-polarized light; and a reflecting member configured to reflect the other of the P-polarized light or the S-polarized light in the same direction as a travel direction of the one of the P-polarized light or the S-polarized light reflected by the reflective polarizing member.

A method for manufacturing an image display device includes: providing a second substrate that comprises a first substrate, and a semiconductor layer on the first substrate, the semiconductor layer comprising a light-emitting layer; providing a third substrate comprising a circuit, the circuit comprising a circuit element; bonding the semiconductor layer to the third substrate; forming a light-emitting element by etching the semiconductor layer; covering the light-emitting element with a light-transmissive insulating member; and forming a wiring layer electrically connecting the light-emitting element to the circuit element; wherein: the light-emitting element has a light-emitting surface opposite to a surface of the light-emitting element that is bonded to the third substrate; and the insulating member is configured to cause light radiated from the light-emitting element to have a light distribution in a normal direction of the light-emitting surface toward a light-emitting surface side.

A method for manufacturing an image display device includes: providing a semiconductor growth substrate comprising a semiconductor layer on a first substrate, the semiconductor layer comprising a light-emitting layer; providing a second substrate comprising a circuit, wherein the circuit comprises a circuit element; forming a light-shielding layer on the second substrate; forming an insulating film on the light-shielding layer; bonding the semiconductor layer to the second substrate on which the insulating film is formed; forming a light-emitting element by etching the semiconductor layer; forming an insulating layer that covers the light-emitting element; and electrically connecting the light-emitting element to the circuit element. The light-shielding layer is located between the light-emitting element and the circuit element. In a plan view, the light-shielding layer covers the circuit element.

A method of manufacturing an image display device includes: providing a semiconductor growth substrate comprising a semiconductor layer; providing a circuit substrate comprising: a circuit element, a first wiring layer, and a first insulating film; forming a first metal layer that is located on the first insulating film and is electrically connected to the first wiring layer; bonding the semiconductor growth substrate to the circuit substrate and electrically connecting the first metal layer to the semiconductor layer; etching the semiconductor layer to form a light-emitting element; etching the first metal layer to form a plug electrically connected to the light-emitting element; forming a second insulating film covering the plug, the light-emitting element, and the first insulating film; removing a portion of the second insulating film to expose a light-emitting surface of the light-emitting element; and forming a second wiring layer electrically connected to the light-emitting surface.

A method for manufacturing an image display device includes: providing a second substrate that includes a first substrate, and a semiconductor layer grown on the first substrate, the semiconductor layer including a light-emitting layer; providing a third substrate including: a circuit including a circuit element formed on a light-transmitting substrate, a first insulating film covering the circuit, and a conductive layer including a light-reflective part formed on the first insulating film; bonding the semiconductor layer to the third substrate; forming a light-emitting element from the semiconductor layer; forming a second insulating film covering the conductive layer, the light-emitting element, and the first insulating film; forming a via extending through the first and second insulating films; and electrically connecting the light-emitting element and the circuit element by the via.

The method for manufacturing a display device includes forming a light emitting element and a terminal on a substrate, forming a sealing film including a first inorganic insulating film and a second inorganic insulating film to cover the light emitting element and the terminal, forming a resist having a taper shape in which a thickness of an end portion on the sealing film becomes thinner as it goes to the terminal side by using a gray-tone mask, forming a taper shape in which thicknesses in end portions of the first inorganic insulating film and the second inorganic insulating film becomes thinner as it goes to the terminal side by etching, forming a touch electrode above the sealing film and forming wiring connected to the terminal via the end portions together with connecting to the touch electrode for detecting a touched position.

Sensor device

A light source unit includes a display device configured to display an image, a reflective polarizing element on which light emitted from the display device is incident, a reflecting member, and a waveplate. The reflective polarizing element transmits a first polarized light and reflects a second polarized light. The reflecting member reflects, toward the reflective polarizing element, light transmitted by the reflective polarizing element. The waveplate is interposed in a portion of an optical path between the reflective polarizing element and the reflecting member. The optical path is of light emitted from the display device, transmitted by the reflective polarizing element, reflected by the reflecting member, and reflected by the reflective polarizing element. A normal of the waveplate is tilted with respect to a direction of the optical path transmitted by the waveplate partway from the reflective polarizing element toward the reflecting member.

Light source unit and image display device

An image display device includes a plurality of driving circuits disposed on a substrate, and a plurality of light emitting elements corresponding to a plurality of pixels respectively. Each of the plurality of driving circuits being configured to provide a driving current to each of the plurality of light emitting elements and to control the driving current by a pulse amplitude modulation and a pulse width modulation. The driving circuit being configured using TFTs.

A manufacturing method of an embodiment includes: providing a semiconductor growth substrate including a semiconductor layer including a light-emitting layer on a first substrate; forming a first insulating film on a second substrate that includes a circuit that includes a circuit element and a first wiring layer; forming a plug in the first insulating film to be connected with the circuit element; bonding the semiconductor layer to the second substrate and electrically connecting the plug to the semiconductor layer; forming a light-emitting element electrically connected to the plug by patterning the semiconductor layer; forming a second insulating film that covers the light-emitting element and the first insulating film; exposing a portion of the light-emitting element by removing a portion of the second insulating film; and forming a second wiring layer on the second insulating film.

Growing community of inventors

Kokubunji, Japan

Hajime Akimoto