Texas Instruments Corporation

Tyco Electronics Services Gmbh

Haiying Li

Benjamin Michael Sutton

Ming Li

Sidharth Dalmia

William Lee Harrison

Mark McGrath

An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Embedded coil assembly and method of making

An embodiment of coil assembly includes a laterally disposed ferrite ring having a central opening. A laterally disposed annular conductive member is positioned above the ferrite ring and has a plurality of spaced-apart circumferential segments. A plurality of bond wires are connected at opposite ends thereof to outer and inner portions of the plurality of spaced-apart circumferential segments. A layer of mold compound covers the ferrite ring and the bond wires.

Embedded coil assembly and production method

A planar electronic device includes a dielectric substrate having a recess. A functional electrical component is disposed within the recess of the substrate. A vent opening extends within the substrate such that the vent opening intersects the recess within a thickness of the substrate. The vent opening is open to atmosphere such that the vent opening fluidly connects the recess to the atmosphere.

Planar electronic device having a magnetic component

A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning.

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Elk Grove, CA, United States of America

Haiying Li