Boe Technology Group Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Haixu Li

Zhanfeng Cao

Guangcai Yuan

Qi Yao

Ke Fei Wang

Jianguo Wang

Zhiwei Liang

Zhijun Lv

Yingwei Liu

Xue Dong

Huijuan Wang

Feng Zhang

Xin Gu

Muxin Di

Dapeng Xue

Feng Qu

Fei Wang

Guoqiang Wang

Ke Wang

Shengguang Ban

Mingxing Wang

Wenqian Luo

Hsuanwei Mai

Fanna Meng

Lei Chen

Lingyun Shi

Qi Qi

Lu Yu

Xiao Lin Zhang

Libo Wang

Wenqu Liu

Liwen Dong

Zhao Cui

Kang Guo

Jing Feng

Xiaoxin Song

Xinhong Lu

Detian Meng

Shuilang Dong

Fei Gao

Junjie Ma

Zhiyong Liu

Xin Ma

Xuerong Wang

Xuan Liang

Qingzhao Liu

Pengfei Cheng

Junwei Yan

Yuanda Lu

Guocai Zhang

Shulei Li

Xuqing Feng

Da Lu

The disclosure provides an apparatus for transferring LED chips, including: first light source configured to generate and emit first light rays; first support structure configured to carry load substrate, load substrate including light-transmissive substrate and the LED chips fixed on side of the light-transmissive substrate away from first light source by dissociation adhesive; second support structure configured to carry to-be-transferred substrate on side of the LED chips away from light-transmissive substrate; and optical control mechanism on side of light-transmissive substrate away from the LED chips and configured to control propagation direction of first light rays that irradiate onto first radiation region of the optical control mechanism to form target light rays that irradiate onto target radiation region of load substrate, so that dissociation adhesive in target radiation region is dissociated to transfer LED chips in target radiation region to to-be-transferred substrate.

Apparatus for transferring light-emitting diode chip

The embodiments of the present application provide a carrier plate and a transferring device. The carrier plate particularly includes a transporting base plate, a dissociation regulating feature and a dissociable-adhesive layer that are sequentially arranged, the dissociation regulating feature is configured to regulate a dissociation accuracy of the dissociable-adhesive layer, and the dissociable-adhesive layer is configured to be connected to a plurality of light-emitting-diode chips. The carrier plate can increase the yield and the dissociation accuracy of the light-emitting-diode chips, which can increase the yield in the process of the mass transfer and the efficiency of the mass transfer of the light-emitting-diode chips.

Carrier plate and transferring device

A driving backplane, a display panel and a display apparatus are provided. The driving backplane includes: a base substrate, and a plurality of connection electrode groups and a plurality of correction structures disposed on the base substrate, each of the connection electrode groups includes: a first connection electrode and a second connection electrode the first connection electrode and the second connection electrode are arranged on a same layer; a first gap is formed between the first connection electrode and the second connection electrode, and a first group of opposite edges includes: an edge, close to the first gap, of the first connection electrode; and an edge, close to the first gap, of the second connection electrode; a second group of opposite edges includes: an edge, far away from the first gap, of the first connection electrode; and an edge, far away from the first gap, of the second connection electrode.

Driving backplane, display panel and display apparatus

A light-emitting diode substrate, a manufacturing method thereof, and a display device are disclosed. The manufacturing method of the light-emitting diode substrate includes: forming an epitaxial layer group of M light-emitting diode chips on a substrate; transferring N epitaxial layer groups on N substrates onto a transition carrier substrate, the N epitaxial layer groups on the N substrates being densely arranged on the transition carrier substrate; and transferring at least part of N*M light-emitting diode chips corresponding to the N epitaxial layer groups on the transition carrier substrate onto a driving substrate, an area of the transition carrier substrate is greater than or equal to a sum of areas of the N substrates, M is a positive integer greater than or equal to 2, and N is a positive integer greater than or equal to 2.

Light-emitting diode substrate and manufacturing method thereof, display device

A display panel and a manufacture method thereof, and a display apparatus are provided. The display liquid crystal panel includes a first substrate and a second substrate opposite to each other; the light control panel includes a third substrate and a fourth substrate opposite to each other. The second substrate and the third substrate are between the first substrate and the fourth substrate. The light control liquid crystal layer is between the first polarizer and the second polarizer; the first polarizer is between the second polarizer and the third polarizer, and the display liquid crystal layer is between the first polarizer and the third polarizer. The first polarizer, the second polarizer, and the third polarizer are configured to allow backlight to emit out of the fourth substrate after passing through the second polarizer, the first polarizer, and the third polarizer in sequence.

Display panel and manufacture method thereof, display apparatus

An array substrate and a manufacturing method thereof and a display device are provided. The array substrate includes a base substrate, a polarizer, a plurality of active elements, a first organic protective layer and a first inorganic protective layer. The polarizer is located on a first side of the base substrate; the plurality of active elements are arranged in an array form and provided on a second side of the base substrate opposite to the first side; the first organic protective layer is located on a side of the polarizer facing away from the base substrate and covers the polarizer; and the first inorganic protective layer is located on a side of the first organic protective layer facing away from the polarizer and covers the first organic protective layer.

Array substrate and manufacturing method thereof, and display device

The present disclosure provides a display backplane including an array substrate including at least one pixel unit each including at least one TFT; a planarization layer covering the array substrate; a pad layer including pads on the planarization layer, surface of the pad away from the planarization layer being first surface, each pixel unit being provided with one pad electrically coupled to a driving thin film transistor in a corresponding pixel unit through via hole penetrating through the planarization layer; a passivation layer covering the pad layer and including through holes, each pad corresponding to one through hole, such that the first surface of each pad is exposed through corresponding through hole, and area of top opening of through hole is smaller than area of bottom opening thereof. The present disclosure further provides a fabrication method of the display backplane, a display panel and a fabrication method thereof.

Display backplane and fabrication method thereof, display panel and fabrication method thereof

Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

Display backplate and method for manufacturing same, display panel and method for manufacturing same, and display device

An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.

Array substrate, method for preparing array substrate, and backlight module

A display panel and a manufacture method thereof, and a display apparatus are provided. A display liquid crystal panel and a light control panel that are stacked. The display liquid crystal panel includes a first substrate and a second substrate that are opposite to each other; the light control panel includes a third substrate and a fourth substrate that are opposite to each other. The second substrate and the third substrate are between the first substrate and the fourth substrate. The first polarizer is between the second polarizer and the third polarizer. The first polarizer, the second polarizer, and the third polarizer are configured to allow backlight to emit out of the fourth substrate after passing through the second polarizer, the first polarizer, and the third polarizer in sequence.

The present disclosure relates to a display substrate and a method for manufacturing the same. The display substrate includes: a substrate; a first electrode located on the substrate; and a conductive convex located on the first electrode. A dimension of a cross section of the conductive convex along a plane parallel to the substrate is negatively correlated to a distance from the cross section to a surface of the first electrode.

Display substrate and method for manufacturing the same

A microfluidic substrate and a manufacture method thereof, and a microfluidic panel are provided. The microfluidic substrate includes a base substrate, an acoustic wave generation device, and a first switching circuit. The acoustic wave generation device is on the base substrate and configured to emit an acoustic wave to drive a liquid droplet to move over the microfluidic substrates, the acoustic wave generation devices includes an acoustic wave driving electrode and an acoustic wave generation layer, the first switching circuit is on the base substrate, and the first switching circuit is electrically connected to the acoustic wave driving electrode and is configured to transmit an acoustic wave driving signal to the acoustic wave driving electrode, and the acoustic wave driving electrode is configured to drive the acoustic wave generation layer to generate the acoustic wave under control of the acoustic wave driving signal.

Microfluidic substrate and manufacture method thereof, microfluidic panel

Disclosed are a transfer carrier and a manufacturing method thereof, and a method for transferring a light-emitting diode chip. The transfer carrier includes: a substrate having a plurality of via holes penetrating a thickness of the substrate, the substrate having a first surface and second surface which are opposite to each other; and thermoplastic structures filling corresponding ones of the via holes, one end of the thermoplastic structures protruding from the second surface of the substrate, and the other end covering a surrounding area on the first surface, of the corresponding via holes.

Transfer carrier and manufacturing method thereof, and method for transferring light-emitting diode chip

The embodiments of the present disclosure relate to the field of display technologies, in particular to a metal wire grid polarizer and a manufacturing method thereof, and a display device. The metal wire grid polarizer includes a base substrate and a plurality of metal wire grids. The base substrate has a plurality of binding areas and a plurality of binding contraposition areas. The metal wire grids are disposed on the base substrate and arranged parallel to each other, and orthographic projections of the metal wire grids on the base substrate do not overlap with the binding areas or the binding contraposition areas, to avoid the metal wire grids from shielding light in the binding process, ensure the alignment process to proceed smoothly, and realize the binding accuracy.

Metal wire grid polarizer and manufacturing method thereof, display device

Growing community of inventors

Beijing, China

Haixu Li