Huawei Technologies Co., Limited

Haiwei Zhang

Yaojiang Zhang

Haotao Hu

This disclosure discloses implementations for high-bandwidth antenna in package (AiP) apparatuses. In an example, an AiP apparatus comprises: a first radiator, a second radiator, a first substrate, a second substrate, a first metal piece, and a first feeding path. The first radiator and the first feeding path are disposed on the first substrate, the second radiator is disposed on the second substrate, the first feeding path is configured to feed the first radiator, and the second radiator and the first radiator are connected using the first metal piece disposed between the first substrate and the second substrate.

High-bandwidth antenna in package apparatus

This disclosure discloses high-bandwidth antenna in package (AiP) apparatuses. In an example, an AiP apparatus comprises: a first radiator; a second radiator; a first substrate; a second substrate; a first metal piece; and a first feeding path, wherein the first radiator and the first feeding path are disposed on the first substrate, wherein the second radiator is disposed on the second substrate, wherein the first feeding path is configured to feed the first radiator, and wherein the second radiator and the first radiator are connected using the first metal piece disposed between the first substrate and the second substrate.

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Dongguan, China

Haiwei Zhang