Boe Technology Group Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Boe Mled Technology Co., Ltd.

Beijing Boe Display Technology Co., Ltd.

Boe (Hebei) Mobile Display Technology Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Boe Meld Technology Co., Ltd.

Beijing Haiju Electronic Technology Co., Ltd.

Haiwei Sun

Jian Sang

Junjie Ma

Lu Yu

Xue Dong

Ruijun Dong

Guangquan Wang

Gongtao Zhang

Ming Zhai

Shubai Zhang

Lingyun Shi

Lili Chen

Chenru Wang

Yutao Hao

Xuerong Wang

Jinpeng Li

Pei Li

Zhihui Zeng

Yuanda Lu

Chao Liu

Yinwei Chen

Zhen Wang

Zhiyong Chen

Hao Zhang

Dong Chen

Ming Jin Chen

Shuo Wang

Feifei Wang

Wei Gong

Shipeng Wang

Wei Hao

Zhongbao Wu

Wengang Su

Rui Shi

Zhonghua Li

Pengfei Cheng

Pengjun Cao

Wei Sun

Liang Gao

Tingting Zhao

Fei Gao

Hyungkyu Kim

Heling Zhu

Ruoyu Ma

Linhui Gong

Kangle Chang

Caizheng Zhang

Lili Wang

Kai Yang

Yali Liu

Litao Fan

Site Cai

Yali Zhang

Zhiqiang Zhang

Qin Xin

Zhiyuan Wang

Jingfu Tao

Yezhou Tan

Jing Wang

Peng Liu

Bo Gao

Jian Zhang

Xin Li

Qian Wang

Feng Qu

Jian Li

Wei Bai

Jing Li

Jiantao Liu

Jing Liu

Renwei Guo

Jia Liu

Dan Li

Zhiqiang Wang

Jie Liu

Bochang Wang

Jie Xu

Yujie Liu

Xiurong Wang

Hai Tang

Yun Qiao

Yafei Li

Liqiang Wang

Bo Han

Jingjing Zhang

Guofeng Hu

Qibing Gu

Wenjia Sun

Quanhua He

Zhiyu Sun

Zezhou Yang

Xuebing Zhang

Jianwei Qin

Lili Jia

Wenchieh Huang

Jinzhao Zhou

Teng Zhang

Jinxing Liu

Meiling Jin

Sha Feng

A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The connection line includes a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion includes a plurality of connection sub-portions, each of the connection sub-portions includes at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair.

Backplane and glass-based circuit board

A display module includes a display panel with a plurality of bonding electrodes arranged at intervals along a selected side edge of a non-display surface and divided into two bonding electrode groups, a first flexible circuit board and a second flexible circuit board. For the first flexible circuit board, each first conductive contact piece in a first wiring region is connected to a bonding electrode in a first bonding electrode group. For the second flexible circuit board, each second conductive contact piece in a second wiring region is connected to a bonding electrode in a second bonding electrode group. The first wiring region is closer to the selected side edge than the second wiring region in a first direction. The first fan-out region is spaced apart from the second wiring region in a second direction perpendicular to the first direction.

Display module and method for manufacturing the same, and display device

A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.

Light-emitting diode chip, display substrate and manufacturing method thereof

A backplane includes: a substrate including a circuit structure layer and a second reflective layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in a through hole. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

Backplane and method for manufacturing the same, and display device

A display substrate includes a substrate, light-emitting devices disposed on a side of the substrate, a first light dimming layer disposed on the side of the substrate, and a first fixing layer disposed on a side of the light-emitting devices and the first light dimming layer away from the substrate. The light-emitting devices are arranged at intervals from each other and divided into a plurality of groups of light-emitting devices, and each group of light-emitting devices includes at least one light-emitting device. The first light dimming layer includes portions each located between two adjacent groups of light-emitting devices, and a gap exists between a portion of the first light dimming layer and at least one side face of at least one light-emitting device adjacent thereto. A portion of the first fixing layer is located in the gap. The first fixing layer is a light-transmitting film.

Display substrate and method for manufacturing the same, and display apparatus

A display panel includes a display module and a lens layer. The display module has a display region and includes a plurality of pixel units disposed in the display region and distributed in an array, each pixel unit is configured to emit light. The lens layer is disposed on a display side of the display module. Light emitted by the plurality pixel units passes through the lens layer to form a display image, and the display image includes a plurality of pixels distributed in an array. The number of pixel units included in a row of pixel units in a first direction is less than the number of pixels included in a row of pixels in the first direction. A first pixel distance is smaller than a first pixel unit distance.

Display panel, method for manufacturing the same, and display apparatus

A display panel includes a plurality of sub-panels tiled in sequence along a first direction. The sub-panels have a first edge and a second edge in the first direction. The sub-panels include a column of first pixels closest to the first edge, a column of second pixels closest to the second edge, and a plurality of columns of third pixels between the column of first pixels and the column of second pixels. A sum of a distance between effective display bodies in the first pixels and the first edge and a distance between effective display bodies in the second pixels and the second edge is smaller than a spacing between effective display bodies in two adjacent columns of the third pixels.

Display panel and display apparatus

A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Light-emitting chip and light-emitting substrate

An array substrate is provided. In the array substrate, an organic material layer includes a first planar portion, a bending portion and a second planar portion which are connected in sequence. The first planar portion and the second planar portion are disposed on both sides of a base substrate. A lead structure includes a first lead portion, a bent lead portion and a second lead portion which are connected in sequence, wherein the first lead portion is disposed outside the first plane portion, the bent lead portion is disposed outside the bending portion, and the second lead portion is disposed outside the second plane portion. An LED layer and a control circuit are respectively disposed on the both sides of the base substrates.

Array substrate and method for manufacturing same, and display device

This invention introduces a pneumatic chip transfer mechanism for laser ungluing needles in the semiconductor optoelectronic field. It comprises upper and lower platform mobile systems, and a central transfer platform system equipped with a transfer slide, vertical power module, needle clamping bracket, and a laser-assisted needle assembly. This assembly includes a laser section with a window, a pneumatic section with an inlet hole, and a micro-hole needle aimed at the blue film assembly on the lower platform. A camera assembly, laser bracket, and laser generator are also integral parts. The mechanism employs a laser generator to modify blue film material properties, creating a bubble that facilitates chip detachment onto a target substrate. This design ensures efficient, flexible Mini/Micro LED chip transfers, revolutionizing chip detachment methods with its innovative approach to leveraging laser and pneumatic technologies for optimal performance.

Pneumatic chip huge transfer mechanism for a laser ungluing needle

A display substrate includes a base substrate, a plurality of light-emitting units, a protecting layer and a connecting line. The base substrate is a transparent substrate, and the plurality of light-emitting units, the protecting layer and the connecting line are laminated in sequence along a direction distal from the base substrate. A via is arranged in the protecting layer, one end of the connecting line is connected to the plurality of light-emitting units through the via, and the other end of the connecting line is configured to connect to a driving circuit of a display apparatus.

Display substrate, spliced display panel and display apparatus

A display substrate includes a base, a plurality of light-emitting devices disposed on a side of the base, and a light adjustment layer. The plurality of light-emitting devices are spaced apart from each other. At least part of the light adjustment layer is located in gaps among the plurality of light-emitting devices, so that side walls of at least one of the plurality of light-emitting devices are surrounded by the light adjustment layer. A material of the light adjustment layer includes a light-absorbing material. The light adjustment layer is configured to absorb light incident on the light adjustment layer.

Display substrate and method of manufacturing the same, and display device

A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The connection line comprises a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion comprises a plurality of connection sub-portions, each of the connection sub-portions comprise at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair.

The present disclosure provides a flexible circuit board, a light bar, a light source and a display device. The light source includes a flexible circuit board having at least one effective welding portion and a light bar having at least one effective pad, the at least one effective welding portion being in one-to-one correspondence with the at least one effective pad, and the effective welding portion being fixed to a corresponding effective pad to transmit a signal loaded by itself to the corresponding effective pad. The flexible circuit board further includes at least one auxiliary welding portion, the light bar further includes at least one auxiliary pad that is in one-to-one correspondence with the at least one auxiliary welding portion, and the auxiliary welding portion is fixed to a corresponding auxiliary pad to enhance the firm fixing between the flexible circuit board and the light bar.

Flexible circuit board, light bar, light source and display device

Growing community of inventors

Beijing, China

Haiwei Sun